Semiconductor device and method of fabricating semiconductor device
View Patent ↗A semiconductor device including a semiconductor chip having external connecting terminals formed on one side is restrained to cause chipping in ridge line portion of semiconductor chip. A cover layer 103 is formed on the other side of the semiconductor chip 102 . At least a part of an end portion 106 of the cover layer is outside of the ridge line portion 107 of the semiconductor chip.
1. A semiconductor device, comprising: a semiconductor chip; at least one external connecting terminal formed on one side of the semiconductor chip; and a cover layer formed on another side of the semiconductor chip, wherein a part of an end portion of the cover layer protrudes outside of a ridge line portion of the semiconductor chip, wherein, in a plan view, a wiring layer formed between the one side of the semiconductor chip and the at least one external connecting terminal has substantially a same size as the semiconductor chip, and wherein, in the plan view, the part of the end portion of the cover layer protrudes outside of the wiring layer, and wherein the semiconductor chip spaces apart an entire surface of the wiring layer from the cover layer.
2. The semiconductor device according to claim 1 , wherein the cover layer is formed so as to cover the ridge line portion of the semiconductor chip.
3. The semiconductor device according to claim 1 , wherein a bonding pad is formed on the one side of the semiconductor chip and is respectively connected to each of the at least one external connecting terminal.
4. The semiconductor device according to claim 1 , wherein the cover layer has a planar shape.
5. The semiconductor device according to claim 1 , wherein, in the plan view, the wiring layer extends up to the ridge line portion of the semiconductor chip.
6. The semiconductor device according to claim 1 , wherein the semiconductor chip spaces apart the wiring layer from the cover layer.
7. The semiconductor device according to claim 1 , wherein a bonding pad attached to the one side of the semiconductor chip is connected to the external connecting terminal through the wiring layer.
8. A semiconductor device, comprising:
a semiconductor chip;
at least one external connecting terminal formed on one side of the semiconductor chip; and
a cover layer formed on another side of the semiconductor chip,
wherein a part of an end portion of the cover layer protrudes outside of a ridge line portion of the semiconductor chip,
wherein, in a plan view, a wiring layer formed between the one side of the semiconductor chip and the at least one external connecting terminal has substantially a same size as the semiconductor chip, and
wherein the semiconductor chip spaces apart an entire surface of the wiring layer from the cover layer.