Flip-chip type semiconductor device
View Patent ↗A flip-chip type semiconductor device includes a semiconductor substrate. A plurality of electrode terminals are provided and arranged on a top surface of the semiconductor substrate, a sealing resin layer is formed on the top surface of the semiconductor substrate such that the electrode terminals are completely covered with the sealing resin layer.
1. An electronic apparatus, comprising:
a first semiconductor device having first electrode terminals; and
a second semiconductor device having second electrode terminals of solder material and mounted by using a sealing resin layer containing a filler on said first semiconductor device, so that said first electrode terminals and said second electrode terminals penetrate said sealing resin layer to seal a space between said first semiconductor device and said second semiconductor device by said sealing resin layer,
a part of said sealing resin layer being pinched in bonding faces between said first electrode terminals and respective ones of said second electrode terminals, a part of said filler breaking into the solder material of said second electrode terminals.
2. The electronic apparatus as set forth in claim 1 , wherein said filler is conductive.
3. The electronic apparatus as set forth in claim 1 , wherein said filler is nonconductive.
4. The electronic apparatus as set forth in claim 2 , wherein said filler comprises a plurality of conductive solid particles.
5. The electronic apparatus as set forth in claim 3 , wherein said filler comprises a plurality of hard resin particles.
6. The electronic apparatus as set forth in claim 1 , wherein said first electrode terminals are metal bumps.
7. The electronic apparatus as set forth in claim 6 , wherein said metal bumps are made of gold.
8. The electronic apparatus as set forth in claim 1 , wherein the filler of said second sealing resin layer breaks through oxide skins on said first and second electrode terminals.