Patent Assignment
Reel/Frame 021714/0927
Assignment of Assignor's Interest
Recorded: 2008-10-21
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Integrated Circuit Contact Pads Using Electroless Plating of Diffusion Barrier Layers
Application:
12/255,329 →
Publication:
US 2010/0099250
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.