Patent Assignment
Reel/Frame 022106/0373
Assignment of Assignor's Interest
Recorded: 2009-01-14
Pages: 5
Assignor
INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Executed: 2009-01-13
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Properties
(4)
Methods of Forming Integrated Circuit Contact Pads Using Electroless Plating of Diffusion Barrier Layers
Application:
12/255,329 →
Publication:
US 2010/0099250
Metal Gate Transistors
Application:
12/260,095 →
Publication:
US 2010/0102393
Transceiver for Communicating Over Different Media Types
Resistors and Methods of Manufacture Thereof
Application:
12/336,702 →
Publication:
US 2010/0148262
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 21, 2008
From: JANG, WOO JIN; CHO, SUNG DONG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 021714/0927 →
Assignment of Assignor's Interest
Oct 29, 2008
From: THEAN, VOON-YEW
To: FREESCALE SEMICONDUCTOR INC.
Reel/Frame 021751/0396 →
Assignment of Assignor's Interest
Oct 29, 2008
From: HAN, JIN-PING
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 021751/0393 →
Assignment of Assignor's Interest
Oct 29, 2008
From: LEE, JAMES YONG MENG
To: CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
Reel/Frame 021751/0388 →
Assignment of Assignor's Interest
Dec 9, 2008
From: MOON, BUM KI
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 021942/0760 →
Assignment of Assignor's Interest
Dec 17, 2008
From: STAHRENBERG, KNUT; ELLER, MANFRED; HAN, JIN-PING; KWON, O SUNG
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 021992/0226 →
Assignment of Assignor's Interest
Dec 17, 2008
From: BACH, KARL-HEINZ; HAMPP, ROLAND
To: INFINEON TECHNOLOGIES AG
Reel/Frame 021992/0189 →
Assignment of Assignor's Interest
Dec 18, 2008
From: NEUROHR, NORBERT; CLAUSEN, AXEL
To: INFINEON TECHNOLOGIES AG
Reel/Frame 022002/0942 →
Assignment of Assignor's Interest
Dec 18, 2008
From: OKSMAN, VLADIMIR
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 022002/0992 →
Assignment of Assignor's Interest
Jun 3, 2010
From: INFINEON TECHNOLOGIES AG
To: INFINEON TECHNOLOGIES WIRELESS SOLUTIONS GMBH
Reel/Frame 024483/0001 →
Assignment of Assignor's Interest
Jun 15, 2010
From: INFINEON TECHNOLOGIES WIRELESS SOLUTIONS GMBH
To: LANTIQ DEUTSCHLAND GMBH
Reel/Frame 024529/0656 →
Grant of Security Interest in U.S. Patents
Nov 29, 2010
From: LANTIQ DEUTSCHLAND GMBH
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 025406/0677 →
Change of Name
Apr 18, 2012
From: CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
To: CHARTERED SEMICONDUCTOR MANUFACTURING PTE. LTD.
Reel/Frame 028070/0563 →
Change of Name
Apr 18, 2012
From: CHARTERED SEMICONDUCTOR MANUFACTURING PTE. LTD.
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 028070/0565 →
Security Agreement
Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
Security Agreement
Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
Release of Security Interest Recorded at Reel/Frame 025413/0340 and 025406/0677
Apr 17, 2015
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LANTIQ BETEILIGUNGS-GMBH & CO. KG
Reel/Frame 035453/0712 →
Assignment and Assumption of Security Interest in Patents
Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
Assignment and Assumption of Security Interest in Patents
Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
Security Agreement Supplement
Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
Corrective Assignment to Correct the Remove Application 12092129 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement.
Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
Release of Security Interest
Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
Release of Security Interest
Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
Corrective Assignment to Correct the Remove Patents 8108266 and 8062324 and Replace Them with 6108266 and 8060324 Previously Recorded on Reel 037518 Frame 0292. Assignor(S) Hereby Confirms the Assignment and Assumption of Security Interest in Patents.
Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement.
May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →