Patent Assignment
Reel/Frame 021720/0779
Assignment of Assignor's Interest
Recorded: 2008-10-22
Pages: 6
Assignors
SAKAI, HISAO
Executed: 2008-10-09
TAKAHASHI, MASARU
Executed: 2008-10-09
MATSUDA, MITSUYOSHI
Executed: 2008-10-09
DOBASHI, MAKOTO
Executed: 2008-10-09
Assignee
MITSUI MINING & SMELTING CO., LTD.
11-1, OSAKI 1-CHOME, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property
(1)
Electro-Deposited Copper Foil, Surface-Treated Copper Foil Using the Electro-Deposited Copper Foil and Copper Clad Laminate Using the Surface-Treated Copper Foil, and a Method for Manufacturing the Electro-Deposited Copper Foil
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.