Patent Assignment
Reel/Frame 075357/0342
Change of Name
Recorded: 2026-03-31
Pages: 21
Assignor
MITSUI MINING AND SMELTING COMPANY, LIMITED
Executed: 2025-10-01
Assignee
MITSUI KINZOKU COMPANY, LIMITED
1-11-1, OSAKI, SHINAGAWA-KU, TOKYO, 141-8584, JAPAN
Covered Properties
(246)
Polymer-Ceramic Composites with Excellent Tcc
Electro-Deposited Copper Foil, Surface-Treated Copper Foil Using the Electro-Deposited Copper Foil and Copper Clad Laminate Using the Surface-Treated Copper Foil, and a Method for Manufacturing the Electro-Deposited Copper Foil
Copper Foil with Carrier Sheet, Method for Manufacturing Copper Foil with Carrier Sheet, and Surface-Treated Copper Foil with Carrier Sheet
Passive Electrical Devices and Methods of Fabricating Passive Electrical Devices
Oxide Sintered Body and Production Method Therefor, Target, and Transparent Conductive Film and Transparent Conductive Substrate Obtained by Using the Same
Lithium Transition Metal Oxide Having Layered Structure
Resin Composition for Forming Insulating Layer of Printed Wiring Board
Spinel Type Lithium Transition Metal Oxide
Exhaust Gas Purifying Catalyst
Copper Powder for Conductive Paste and Conductive Paste
Green Emitting Phosphor
Green Emitting Phosphor
Emitting Phosphor
Positive Electrode Active Material for Lithium Battery
Zeolite Beta and Process for Producing the Same
Positive Electrode for Nonaqueous Secondary Battery
Negative Electrode Active Material for Nonaqueous Secondary Battery
Positive Electrode Active Material for Lithium-Ion Battery and Lithium-Ion Battery
Manganese Oxide Particles and Process for Producing Same
Zeolite Production Method
Exhaust Gas Purifying Catalyst and Production Method for Same
Spinel-Type Lithium Transition Metal Oxide and Positive Electrode Active Material for Lithium Battery
Zeolite, Manufacturing Method of the Same, and Catalytic Cracking Batalyst of Paraffin
Metal Foil Provided with Filler-Containing Resin Layer and Method for Manufacturing Metal Foil Provided with Filler-Containing Resin Layer
Lithium-Manganese-Type Solid Solution Positive Electrode Material
Electroconductive Particles
Fluorine-Doped Tin-Oxide Particles and Manufacturing Method Therefor
Sulfur-Containing Phosphor Coated with Zno Compound
Method of Manufacturing a Positive Electrode Active Material for Lithium Secondary Batteries
Spinel-Type Lithium Manganese-Based Composite Oxide
Manufacturing Method of Multilayer Printed Wiring Board
Light-Emitting Device
Method for Combusting Diesel Exhaust Gas
Carrier for Internal-Combustion Engine Exhaust Gas Purification Catalyst
Thermal Spray Material and Process for Preparing Same
Negative Electrode Active Material for Nonaqueous Electrolyte Secondary Batteries
Catalyst
Catalyst Carrier for Exhaust Gas Purification and Catalyst for Exhaust Gas Purification
Exhaust Gas Purification Catalyst, and Exhaust Gas Purification Catalyst Structure
Polishing Slurry and Polishing Method
Spinel Type Lithium-Manganese-Nickel-Containing Composite Oxide
Spinel-Type Lithium Manganese Transition Metal Oxide
Catalyst Structure for Treating Exhaust Gas
Negative Electrode Active Material for Nonaqueous Electrolyte Secondary Batteries
Thermal Spray Material
Sic Single Crystal Substrate
Resin Composition, Metal Foil Provided with Resin Layer, Metal Clad Laminate, and Printed Wiring Board
Phosphor, Led Light-Emission Element, and Light Source Device
Manganese Spinel-Type Lithium Transition Metal Oxide
Negative Electrode Active Material for Nonaqueous Electrolyte Secondary Batteries
Negative Electrode Active Material for Nonaqueous Electrolyte Secondary Batteries
Exhaust-Gas-Purification Catalyst Carrier
Catalyst Carrier for Exhaust Gas and Exhaust Gas-Cleaning Catalyst
Spinel-Type Lithium-Manganese Composite Oxide
Copper Powder and Method for Producing Same
Exhaust Gas Purifying Catalyst Comprising a Catalyst Layer Comprising at Least Two Inorganic Porous Particles
Catalyst Composition for Exhaust Gas Purification and Catalyst for Exhaust Gas Purification
Catalyst Carrier and Exhaust Gas Purifying Catalyst
Catalyst Structure for Exhaust Gas Treatment
Catalyst System for Exhaust Gas Purification and Method for Exhaust Gas Purification
Oxide Sintered Body and Method for Manufacturing the Same, Sputtering Target, and Semiconductor Device
Zeolite, Manufacturing Method of the Same, and Catalytic Cracking Catalyst of Paraffin
Positive Electrode Active Material for Lithium Secondary Battery
Positive Electrode Active Material for Lithium Secondary Battery
Exhaust Gas Purification Catalyst Composition and Exhaust Gas Purification Catalyst
Diesel Particulate Filter and Exhaust Gas Purification Device
Crystalline Solid Electrolyte and Production Method Therefor
Sulfide-Based Solid Electrolyte for Lithium Ion Battery
Abrasive Material, Method for Producing Same, and Abrasive Slurry Containing Same
Method for Manufacturing Over-Lithiated Layered Lithium Metal Composite Oxide
Carrier for Exhaust Gas Purification Catalyst, and Exhaust Gas Purification Catalyst
Exhaust Gas Purification Catalyst and Exhaust Gas Purification Catalyst Structure
Spinel-Type Lithium Metal Composite Oxide
Hydrogen Storing Alloy
Spinel-Type Lithium Cobalt Manganese-Containing Complex Oxide
Copper Clad Laminate for Forming of Embedded Capacitor Layer, Multilayered Printed Wiring Board, and Manufacturing Method of Multilayered Printed Wiring Board
Copper Clad Laminate Provided with Protective Layer and Multilayered Printed Wiring Board
Fuel Reforming Catalyst
Oxide Sintered Body, Sputtering Target, and Oxide Semiconductor Thin Film Obtained Using Sputtering Target
Oxide Sintered Body, Sputtering Target, and Oxide Semiconductor Thin Film Obtained Using Sputtering Target
Oxide Sintered Body and Method for Manufacturing the Same, Sputtering Target, and Semiconductor Device
Metal Foil with Releasing Resin Layer, and Printed Wiring Board
Phosphor and Use Thereof
Membrane Electrode Assembly with a Catalyst Layer Including an Inorganic Oxide Catalyst Carrier and a Highly Hydrophobic Substance and Solid Polymer Fuel Cell Using the Assembly
Surface-Treated Copper Foil, Method for Producing Same, Copper-Clad Laminate for Printed Wiring Board, and Printed Wiring Board
Target Material for Sputtering and Method for Manufacturing Same
Carrier for Exhaust Gas Purification Catalyst and Exhaust Gas Purification Catalyst
Sulfide-Based Solid Electrolyte for Lithium Ion Batteries
Carrier for Exhaust Gas Purification Catalyst
Abrasive Material
Zeolite Production Method
Zeolite Production Method
Carrier for Exhaust Gas Purification Catalyst and Exhaust Gas Purification Catalyst
Fuel Cell Electrode Catalyst Layer, Production Method Therefor, Membrane Electrode Assembly, and Solid Polymer Fuel Cell
5V-Class Spinel-Type Lithium-Manganese-Containing Composite Oxide
5V-Class Spinel-Type Lithium-Manganese-Containing Composite Oxide
Oxide Sintered Material, Method of Producing Oxide Sintered Material, Sputtering Target, and Method of Producing Semiconductor Device
Halogen-Containing Tin Oxide Particles and Production Method Thereof
Phosphor
Sulfide-Based Solid Electrolyte for Lithium Ion Cell, and Solid Electrolyte Compound
Oriented Apatite-Type Doped Rare Earth Silicate and/or Germanate Ion Conductor and Method for Manufacturing Same
Method for Producing Beta Zeolite
Copper Powder and Conductive Composition Containing Same
Surface-Treated Copper Foil, Manufacturing Method Therefor, Printed Circuit Board Copper-Clad Laminate, and Printed Circuit Board
Tin Oxide, Electrode Catalyst for Fuel Cells, Membrane Electrode Assembly, and Solid Polymer Fuel Cell
Substrate/Oriented Apatite-Type Composite Oxide Film Complex and Method for Producing Same
Silver-Coated Copper Powder
Yttrium Oxyfluoride, Starting Material Powder for Production of Stabilized Yttrium Oxyfluoride, and Method for Producing Stabilized Yttrium Oxyfluoride
Spinel Type Lithium Nickel Manganese-Containing Composite Oxide
Bonding Junction Structure
Powder for Catalysts and Catalyst for Exhaust Gas Purification
Production Method for Printed Wiring Board Having Dielectric Layer
Dendritic Silver Powder
Copper Clad Laminate for Forming of Embedded Capacitor Layer, Multilayered Printed Wiring Board, and Manufacturing Method of Multilayered Printed Wiring Board
Oxide Sintered Body and Method for Manufacturing the Same, Sputtering Target, and Semiconductor Device
Copper Foil with Carrier, Copper Foil with Resin and Method for Manufacturing Printed Wiring Board
Polishing Slurry and Polishing Material
Catalyst Deterioration Detecting System and Catalyst Deterioration Detecting Method
Exhaust Gas-Purifying Composition
Spinel-Type Lithium-Manganese-Containing Complex Oxide
Copper Foil with Carrier, Production Method for Same, Production Method for Coreless Support with Wiring Layer, and Production Method for Printed Circuit Board
Copper Foil with Carrier, Coreless Support with Wiring Layer, and Method for Producing Printed Circuit Board
Multilayer Laminate and Method for Producing Multilayer Printed Wiring Board Using Same
Phosphor
Method for Producing Electrode Catalyst, and Electrode Catalyst
Mse-Type Zeolite Production Method
Oxide Sintered Body and Method for Manufacturing the Same, Sputtering Target, and Semiconductor Device
Exhaust Gas-Purifying Composition
Sulfide-Based Solid Electrolyte for Lithium Secondary Battery
Method of Producing Beta Zeolite
Oxide Sintered Material and Method of Manufacturing the Same, Sputtering Target, and Method of Manufacturing Semiconductor Device
Cathode Active Material for All-Solid-State Lithium Secondary Battery
Method for Producing Electrode Catalyst, and Electrode Catalyst
Production Method for Multilayer Wiring Board
Production Method for Multilayer Wiring Board
Film-Forming Material and Film
Oxide Sintered Material and Method for Manufacturing the Same, Sputtering Target, and Method for Manufacturing Semiconductor Device
Copper Foil with Carrier, Coreless Support with Wiring Layer, and Method for Producing Printed Circuit Board
Membrane Electrode Assembly with a Catalyst Layer Including an Inorganic Oxide Catalyst Carrier and a Highly Hydrophobic Substance and Solid Polymer Fuel Cell Using the Assembly
Rare Earth Oxyfluoride Sintered Body and Method for Producing Same
Polishing Liquid and Polishing Method
Hydrogen Storage Alloy
Semiconductor Device and Method for Manufacturing the Same
Method for Manufacturing Multilayer Wiring Board
Exhaust Gas Purification Catalyst
Delafossite-Type Oxide for Exhaust Gas Purification Catalyst, and Exhaust Gas Purification Catalyst Using Same
Molded Article
Spinel Type Lithium Nickel Manganese-Containing Composite Oxide
Resin Composition, Copper Foil with Resin, Dielectric Layer, Copper Clad Laminate Sheet, Capacitor Element and Printed Wiring Board with Built-in Capacitor
Wiring Board Manufacturing Method
Solid Electrolyte Integrated Device, Method of Manufacturing Solid Electrolyte Integrated Device, and Solid Electrolyte Element
Solid Electrolyte of Lithium Secondary Battery and Sulfide Compound for Said Solid Electrolyte
Si-Based Negative Electrode Active Material
Positive Electrode Active Material for All-Solid-State Lithium Secondary Batteries
Positive Electrode Active Substance for All Solid-State Lithium Secondary Battery
Method for Manufacturing Hard Carbon-Based Coating, and Member Provided with Coating
Copper Foil with Carrier, Coreless Support with Wiring Layer, and Method for Producing Printed Circuit Board
Metal-Substituted Beta Zeolite and Method for Producing Same
Ultra-Thin Copper Foil, Ultra-Thin Copper Foil with Carrier, and Method for Manufacturing Printed Wiring Board
Exhaust Gas Purging Composition
Nitrogen Oxide Sorbent and Exhaust Gas Cleaning Catalyst
Rare Earth Phosphate Particles, Method for Improving Light Scattering Using Same, and Light Scattering Member and Optical Device Including Same
Copper Foil with Carrier
Solid Electrolyte
Oriented Apatite Type Oxide Ion Conductor and Method for Producing Same
Resin Composition, Copper Foil with Resin, Dielectric Layer, Copper-Clad Laminate, Capacitor Element, and Printed Wiring Board with Built-in Capacitor
Exhaust Gas Purification Catalyst
Sintered Metal Carbide and Heat-Resistant Member for Silicon Carbide Semiconductor Manufacturing Device Comprising Same
Composition for Exhaust Gas Purification, Exhaust Gas Purifying Catalyst Containing Same, and Exhaust Gas Purifying Catalyst Structure
Exhaust Gas Purification Device
Exhaust Gas Purification Catalyst
Copper Foil with Glass Carrier and Production Method Therefor
Conductive Film Formation Composition and Method for Manufacturing Conductive Film
Negative Thermal Expansion Material, Composite Material, and Method for Producing Negative Thermal Expansion Material
Exhaust Gas Purification Catalyst
Sulfide-Based Solid Electrolyte Particles
Sulfide-Type Compound Particles, Solid Electrolyte, and Lithium Secondary Battery
Glass Carrier Attached Copper Foil and Method for Producing Same
Copper-Clad Laminate
Sulfide Solid Electrolyte and Battery
Solid Electrolyte Assembly Having Intermediate Layer
Exhaust Gas Purification Catalyst
Exhaust Gas Purification Catalyst
Solid Electrolyte, Electrode Mixture, Solid Electrolyte Layer, and All-Solid-State Battery
Electrode Catalyst Layer for Fuel Cells and Solid Polymer Fuel Cell Using Same
Bonding Composition, Conductor Bonding Structure, and Method for Producing Same
Porous Structure for Exhaust Gas Purification Catalyst, Exhaust Gas Purification Catalyst Using Porous Structure, and Exhaust Gas Purification Method
Method and Device for Isolating and Analyzing Target Substance in Solution
Zinc Foil, Primary Battery Negative Electrode Active Material Using Same, and Zinc Foil Production Method
Material for Cold Spraying
Sulfur-Containing Compound, Solid Electrolyte, and Battery
Semiconductor Package Manufacturing Method, and Adhesive Sheet Used Therein
Carrier-Containing Metal Foil and Method for Manufacturing Millimeter-Wave Antenna Substrate Using Same
Semiconductor Package Manufacturing Method
Multilayer Body
Exhaust Gas Purification Catalyst
Exhaust Gas Purification Catalyst and Production Method Therefor
Multilayer Body
Active Material and Process for Producing the Same
Laminate Sheet and Method of Use Thereof
Composition for Pressure Bonding, and Bonded Structure of Conductive Bodies and Production Method Therefor
Sulfide Solid Electrolyte
Bonded Body and Method for Manufacturing Same
Bonding Material and Bonded Structure
Method for Producing Sulfide Solid Electrolyte
Resin Composition and Resin-Attached Copper Foil
Resin Composition, Copper Foil with Resin, Dielectric Layer, Copper-Clad Laminate, Capacitor Element, and Printed Wiring Board with Built-in Capacitor
Method of Manufacturing Printed Wiring Board
Method for Manufacturing Printed Wiring Board
Sulfide-Based Solid Electrolyte Particles
Film-Forming Material and Film
Powder for Film Formation or Sintering
Sulfide Solid Electrolyte and Method of Producing the Same
Beta-Type Zeolite and Catalyst Containing Same
Exhaust Gas Cleaning Catalyst Structure and Production Method Therefor
Exhaust Gas Purification Catalyst and Exhaust Gas Purification System Using the Exhaust Gas Purification Catalyst
Exhaust Gas Purifying Composition and Production Method Therefor
Solid Electrolyte, and Electrode Mixture, Solid Electrolyte Layer and Solid-State Battery, Each Using Same
Solid Electrolyte, and Electrode Mixture, Solid Electrolyte Layer and Solid-State Battery, Each Using Same
Sulfide Solid Electrolyte
Double-Sided Copper-Clad Laminate
Composition for Provisional Fixation and Method for Producing Bonded Structure
Exhaust Gas Purification Catalyst Composition and Exhaust Gas Purification Catalyst
Exhaust Gas Purification Catalyst
Electrode Catalyst Layer for Fuel Cell, and Solid Polymer-Type Fuel Cell Comprising Said Electrode Catalyst Layer
Exhaust Gas Purification System
Electrolytic Copper Foil
Bonding Sheet and Bonded Structure
Electrolytic Copper Foil
Resin Layered Product, Dielectric Layer, Metal Foil with Resin, Capacitor Element, and Printed Wiring Board with Built-in Capacitor
Metal Foil with Carrier
Multilayer Capacitor
Method for Producing Bonding Composition
Copper Particles and Method for Producing Same
Hydrocarbon Adsorbent
Powder for Film Formation or Sintering
Fine Metal Linear Body
Copper-Clad Laminate Plate and Printed Wiring Board
Silver Powder, Method for Producing Same, and Conductive Resin Composition
Resin Composition Comprising Coated Metal Oxide Particles, Resin-Attached Metal Foil, Metal-Clad Laminated Sheet, and Capacitor Element
Double-Sided Copper-Clad Laminate
Resin Composition, Copper Foil with Resin, and Printed Wiring Board
Roughened Copper Foil, Copper-Cladded Laminate Board, and Printed Wiring Board
Roughened Copper Foil, Copper-Clad Laminate and Printed Wiring Board
Method for Measuring Surface Parameter of Copper Foil, Method for Sorting Copper Foil, and Method for Producing Surface-Treated Copper Foil
Method for Measuring Surface Parameter of Copper Foil, and Method for Sorting Copper Foil
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Feb 17, 2000
From: GALILEO CORPORATION
To: NETOPTIX CORPORATION
Reel/Frame 010822/0602 →
Assignment of Assignor's Interest
Oct 12, 2007
From: PRAMANIK, PRANABES K.; RADEWITZ, JACLYN; YAMAZAKI, KAZUHIRO
To: OAK-MITSUI INC.
Reel/Frame 019959/0852 →
Assignment of Assignor's Interest
Oct 22, 2008
From: SAKAI, HISAO; TAKAHASHI, MASARU; MATSUDA, MITSUYOSHI; DOBASHI, MAKOTO
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 021720/0779 →
Assignment of Assignor's Interest
Dec 17, 2008
From: NAGATANI, SEIJI; WATANABE, HIROSHI; ZUMIDA, KAZUFUMI I
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 021992/0155 →
Assignment of Assignor's Interest
Jan 6, 2009
From: NAGATANI, SEIJI; WATANABE, HIROSHI; IZUMIDA, KAZUFUMI
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 022064/0176 →
Assignment of Assignor's Interest
Jul 23, 2009
From: TAKEUCHI, TOMOYA; KAGEI, SHINYA; KUMADA, NAOKI; MIYANOHARA, KEISUKE
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 022998/0547 →
Assignment of Assignor's Interest
Oct 13, 2009
From: PRAMANIK, PRANABES K.; KAGEYAMA, YUJI; KUWAKO, FUJIO; HWANG, JIN HYUN
To: OAK-MITSUI TECHNOLOGIES LLC
Reel/Frame 023365/0065 →
Assignment of Assignor's Interest
Dec 8, 2009
From: SATO, TETSURO; MATSUSHIMA, TOSHIFUMI
To: MITSUI MINING& SMELTING CO.,LTD.
Reel/Frame 023619/0765 →
Assignment of Assignor's Interest
Dec 14, 2009
From: NAKAYAMA, TOKUYUKI; ABE, YOSHIYUKI
To: SUMITOMO METAL MINING CO., LTD.
Reel/Frame 023667/0752 →
Assignment of Assignor's Interest
Apr 21, 2010
From: KUMADA, NAOKI; KAGEI, SHINYA; HATA, YOSHIMI; SASAKI, KENJI
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 024266/0834 →
Assignment of Assignor's Interest
May 12, 2010
From: WAKABAYASHI, TAKASHI; NAKAHARA, YUUNOSUKE
To: MITSUI MINING & SMELTING CO., LTD
Reel/Frame 024374/0506 →
Assignment of Assignor's Interest
Oct 14, 2010
From: OTA, KOYU; KURIMOTO, TOURU; UWAZUMI, YOSHIAKI; MIYAKE, KOICHI
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 025140/0794 →
Assignment of Assignor's Interest
Jan 31, 2011
From: OGAWARA, RIICHI; SASAKURA, ASUKA; ITOH, JUN-ICHI; MORINAKA, TAIZOU
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 025723/0526 →
Assignment of Assignor's Interest
Jun 15, 2011
From: ITOH, JUN-ICHI; SASAKURA, ASUKA; MORINAKA, TAIZOU
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 026458/0850 →
Assignment of Assignor's Interest
Sep 22, 2011
From: SASAKURA, ASUKA; ITOH, JUN-ICHI; MORINAKA, TAIZO
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 026950/0719 →
Assignment of Assignor's Interest
Sep 23, 2011
From: KAGEI, SHINYA; MIYANOHARA, KEISUKE; HATA, YOSHIMI; OCHI, YASUHIRO
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 026956/0624 →
Assignment of Assignor's Interest
Apr 9, 2012
From: ITABASHI, KENJI; OKUBO, TATSUYA; KAMIMURA, YOSHIHIRO; CHAIKITTISILP, WATCHAROP
To: NIPPON CHEMICAL INDUSTRIAL CO., LTD.; THE UNIVERSITY OF TOKYO
Reel/Frame 028014/0161 →
Assignment of Assignor's Interest
May 10, 2012
From: TODOROV, YANKO MARINOV; TABIRA, YASUNORI
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 028186/0835 →
Assignment of Assignor's Interest
Sep 7, 2012
From: IDE, HITOHIKO; INOUE, DAISUKE; TODOROV, YANKO MARINOV; SHIBAMURA, NATSUMI
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 028913/0920 →
Assignment of Assignor's Interest
Mar 6, 2014
From: NIPPON CHEMICAL INDUSTRIAL CO., LTD.
To: UNIZEO CO., LTD.
Reel/Frame 032369/0028 →
Assignment of Assignor's Interest
Jan 23, 2018
From: UNIZEO CO., LTD.
To: MITSUI MINING & SMELTING CO., LTD.; THE UNIVERSITY OF TOKYO
Reel/Frame 045127/0009 →
Assignment of Assignor's Interest
Jan 30, 2018
From: OAK-MITSUI TECHNOLOGIES LLC.
To: MITSUI MINING & SMELTING CO. LTD.
Reel/Frame 044761/0045 →
Corrective Assignment to Correct the Assignee Address Previously Recorded at Reel: 044761 Frame: 0045. Assignor(S) Hereby Confirms the Assignment.
Feb 27, 2018
From: OAK-MITSUI TECHNOLOGIES LLC.
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 045831/0512 →
Assignment of Assignor's Interest
Mar 22, 2018
From: OAK-MITSUI, INC.
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 045308/0469 →
Assignment of Assignor's Interest
Jan 17, 2019
From: SUMITOMO METAL MINING CO., LTD.
To: MITSUI MINING & SMELTING CO. LTD.
Reel/Frame 048039/0101 →