Glass carrier attached copper foil and method for producing same
A glass carrier-attached copper foil is provided that is suitable for production of a desired circuit mounting board ensuring electric conduction over the entire copper layer, reducing separation of the copper layer at the cut edge even if the copper foil is downsized, and having an intended circuit pattern with a fine pitch. The glass carrier-attached copper foil includes a glass carrier, a release layer provided on the glass carrier, and a copper layer provided on the release layer. The release layer has a function to enable release of the copper layer from the glass carrier. The glass carrier-attached copper foil has a plurality of releasable regions including the release layer and an unreleasable region not including the release layer. The unreleasable region has a pattern defining the releasable regions.
1. A glass carrier-attached copper foil comprising:
a glass carrier;
a release layer provided on the glass carrier;
an intermediate layer between the glass carrier and the release layer; and
a copper layer provided on the release layer,
wherein the release layer has a function to enable release of the copper layer from the glass carrier,
wherein the glass carrier-attached copper foil has a plurality of releasable regions including the release layer and an unreleasable region not including the release layer, the unreleasable region having a pattern defining the releasable regions,
wherein, with respect to a plan view of the glass carrier-attached copper foil, the copper layer is superposed with the release layer and the glass carrier so as to cover at least portions of both the plurality of releasable regions and the unreleasable region,
wherein the unreleasable region has a discontinuous pattern,
wherein a surface of the intermediate layer is inclined to define an inclined surface in which a thickness of the intermediate layer decreases at least at a portion of the unreleasable region, and
wherein the copper layer covers the inclined surface.
2. The glass carrier-attached copper foil according to claim 1 , wherein the intermediate layer comprises at least one metal selected from the group consisting of Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, and Mo.
3. The glass carrier-attached copper foil according to claim 1 , further comprising a functional layer between the release layer and the copper layer, the functional layer composed of at least one metal selected from the group consisting of Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, and Mo.
4. The glass carrier-attached copper foil according to claim 1 , wherein the copper layer has a thickness of 0.05 to 3.0 μm and a maximum height Rz of less than 1.0 μm as measured in accordance with JIS B0601-2001.
5. The glass carrier-attached copper foil according to claim 1 , wherein the glass carrier is made of glass comprising SiO 2 .
6. The glass carrier-attached copper foil according to claim 1 , wherein the pattern of the unreleasable region has a width of 1 to 50 mm.
7. The glass carrier-attached copper foil according to claim 1 , wherein the unreleasable region has a lattice pattern, a fence pattern, or a cruciform pattern.
8. The glass carrier-attached copper foil according to claim 1 , wherein the discontinuous pattern includes discrete units each having at least one shape selected from the group consisting of a circle, an ellipse, a polygon, and a star polygon.
9. The glass carrier-attached copper foil according to claim 8 , wherein the discrete units of the discontinuous pattern each have an area of 100 mm 2 or less.
10. The glass carrier-attached copper foil according to claim 1 , wherein the ratio of the area of the unreleasable region to the total area of the releasable regions and the unreleasable region is 0.01 to 0.5.
11. The glass carrier-attached copper foil according to claim 1 , wherein the unreleasable region is designed to be cut along the pattern such that the glass carrier-attached copper foil is divided into a plurality of pieces.
12. A method of producing the glass carrier-attached copper foil according to claim 1 , comprising:
providing the glass carrier;
disposing a frame at a predetermined distance above a surface of the glass carrier, the frame having a pattern defining a plurality of regions;
forming the release layer and the copper layer in sequence on the glass carrier by physical vapor deposition (PVD) while holding the frame above the glass carrier, such that the unreleasable region not including the release layer is formed in an area hidden by the frame whereas the releasable regions including the release layer are formed in areas not hidden by the frame,
wherein the release layer is deposited to a thickness smaller than that of the copper layer to suppress invasion and deposition of components of the release layer in the area hidden by the frame so as to prevent formation of the release layer in the area hidden by the frame whereas the copper layer is deposited to a thickness larger than that of the release layer to facilitate invasion and deposition of copper in the area hidden by the frame so as to form the copper layer in the area hidden by the frame, and
wherein the distance between the frame and the glass carrier and a width of the frame are determined so as to prevent the formation of the release layer in the area hidden by the frame and to allow the formation of the copper layer in the area hidden by the frame.
13. The method according to claim 12 , wherein the frame and/or the glass carrier are supported by a mechanism adjusting the distance between the frame and the glass carrier.
14. The method according to claim 12 , wherein the frame has an inversely tapered cross-section whose width increases with distance from the surface of the glass carrier, or the frame has a tapered cross-section whose width decreases with distance from the surface of the glass carrier.
15. The method according to claim 12 , wherein the frame is composed of a metal.
16. A method of producing the glass carrier-attached copper foil according to claim 1 , comprising:
providing the glass carrier;
forming the release layer and the copper layer in sequence on the glass carrier to yield a tentative glass carrier-attached copper foil, an entire region of which is covered with the release layer and the copper layer; and
heating the tentative glass carrier-attached copper foil along a pattern defining a plurality of regions such that the release layer present in a region corresponding to the pattern selectively disappears or malfunctions, thereby forming the unreleasable region not including the release layer and the releasable regions including the release layer that remains.
17. The method according to claim 16 , wherein the heating is carried out by laser beam irradiation.
18. The method according to claim 16 , wherein the release layer and the copper layer are formed by physical vapor deposition (PVD).