Copper clad laminate provided with protective layer and multilayered printed wiring board
An object of the present invention is to provide a multilayered printed wiring board provided with split through holes excellent in through-hole formability and co-planarity in inner layer wirings around through holes for providing of a conduction isolation portion. To achieve the object, “a copper clad laminate provided with a protective layer for manufacturing of a printed wiring board having a conduction isolation portion electrically isolating a through hole, the copper clad laminate is characterized in that the copper clad laminate is provided with a protective layer on the surface that can be released after forming of the through holes for providing of a conduction isolation portion and filling of the through holes for providing of a conduction isolation portion by a plating resist” is employed.
1. A copper clad laminate used for manufacturing of a printed wiring board having a conduction isolation portion that electrically isolates at least one through hole, comprising:
at least one copper layer; and
a protective layer provided on an outer surface of the at least one copper layer, wherein
the protective layer is configured to be mechanically released from the at least one copper layer after the at least one through hole is provided in the printed wiring board and after the through hole is filled with a plating resist to provide the conduction isolation portion of the printed wiring board,
the protective layer has a thickness between 2 μm and 50 μm,
the protective layer has a resin layer that can be released from the surface of the copper clad laminate after heating at 160° C. to 240° C. for 60 min to 120 min,
the resin layer is comprised of a resin film layer and an adhesive layer formed on the surface of the resin film layer between the copper layer and the resin film layer, and the adhesive layer is configured to be released from the surface of the copper clad laminate,
the protective layer has the resin film layer, the adhesive layer formed on the surface of the resin film layer between the copper layer and the resin film layer, and a reinforcing metal layer on an outside surface of the resin film layer, and
the resin film layer comprises at least one component selected from the group consisting of polyimide, polyamide, polyamide-imide, polybenzimidazole, polyethersulfone, a liquid crystal polymer, syndiotactic polystyrene, polyether ether ketone, polysulfone, polyphenylene sulfide, polyether imide, cycloolefin, polyethylene terephthalate, polybutylene terephthalate, polymethylpentene, ultra-high molecular weight polyethylene, polyvinylidene fluoride, polyethylene naphthalate, polyolefin, a fluorine-containing resin, an ethylene-tetrafluoroethylene copolymer, polyacetal, polycarbonate, polyphenylene ether, polyarylate, phenoxy resin, and a styrene-butadiene copolymer.
2. The copper clad laminate according to claim 1 , wherein the adhesive layer contains at least one component selected from the group consisting of a rubber-based material, a silicone resin, and an acrylic resin.
3. The copper clad laminate according to claim 1 , wherein the protective layer is comprised of the resin layer, the reinforcing metal layer provided on the outside surface of the resin layer, and a releasing layer provided on the outside surface of the reinforcing metal layer.
4. The copper clad laminate according to claim 3 , wherein the releasing layer is comprised of at least one organic agent selected from the group consisting of a nitrogen-containing organic compound, a sulfur-containing organic compound and a carboxylic acid.
5. The copper clad laminate according to claim 3 , wherein
the releasing layer has a thickness of 1 nm to 1 μm.
6. The copper clad laminate according to claim 1 , wherein the reinforcing metal layer comprises at least one metal selected from the group consisting of copper, a copper alloy, aluminum, an aluminum alloy, nickel, and a nickel alloy.
7. The copper clad laminate according to claim 1 , wherein
the reinforcing metal layer has a thickness of 1 μm to 35 μm.
8. The copper clad laminate according to claim 1 , wherein
the resin film layer has a thickness of 1 μm to 35 μm,
the adhesive layer has a thickness of 2 μm to 45 μm, and
the reinforcing metal layer has a thickness of 1 μm to 35 μm.
9. A multilayered printed wiring board manufactured by using the copper clad laminate according to claim 1 .