IP Library Granted Patent US 11,569,528
Granted Patent B2
US 11,569,528 · App. 16/604,182 · Granted Jan 31, 2023

Solid electrolyte integrated device, method of manufacturing solid electrolyte integrated device, and solid electrolyte element

Inventors: Shingo Ide (Saitama, JP); Isamu Yashima (Saitama, JP); Kenji Kume (Saitama, JP)
Assignee: MITSUI MINING & SMELTING CO., LTD.
H01M10/0562C25B9/23C25B1/02
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Quick Facts
Patent No.
US 11,569,528
App. No.
16/604,182
Granted
Jan 31, 2023
Kind
B2
Abstract

In a solid electrolyte integrated device including a substrate with electrically insulated surfaces, a first lower electrode layer and a second upper electrode layer are electrically connected to each other on a first main surface side, and a first upper electrode layer, the first lower electrode layer, the second upper electrode layer, and a second lower electrode layer transmit ions and/or have ion redox ability, contain a metal or a metal oxide or both of a metal and a metal oxide, and have a permeable portion.

Claims (36)

1. A solid electrolyte integrated device including a substrate with electrically insulated surfaces including a first main surface disposed on one side and a second main surface disposed on an opposite side of the first main surface, the substrate having two through-holes, a first through-hole and a second through-hole, between the first main surface and the second main surface,

the solid electrolyte integrated device comprising:

a first lower electrode layer, which is conductive, disposed on the first main surface so as to cover a portion of a first opening on the first main surface side of the first through-hole or to surround an edge of the portion of the first opening;

a first solid electrolyte layer disposed on and electrically connected to the first lower electrode layer;

a first upper electrode layer disposed on the first main surface side so as to be separated from the first lower electrode layer by the first solid electrolyte layer and electrically connected to the first solid electrolyte layer;

a second lower electrode layer, which is conductive, disposed on the first main surface so as to cover a portion of a second opening on the first main surface side of the second through-hole or to surround an edge of the portion of the second opening;

a second solid electrolyte layer disposed on the second lower electrode layer so as to be separated from the first solid electrolyte layer and electrically connected to the second lower electrode layer; and

a second upper electrode layer disposed on the first main surface side so as to be separated from the second lower electrode layer by the second solid electrolyte layer and electrically connected to the second solid electrolyte layer,

wherein the first lower electrode layer and the second upper electrode layer are electrically connected to each other on the first main surface side,

wherein the first upper electrode layer, the first lower electrode layer, the second upper electrode layer, and the second lower electrode layer transmit ions and/or have ion redox ability, contain a metal or a metal oxide or both of a metal and a metal oxide, and have a permeable portion,

wherein the first lower electrode layer has a third through-hole formed in a vertical direction to continue to the first through-hole of the substrate,

wherein the second lower electrode layer has a fourth through-hole formed in the vertical direction to continue to the second through-hole of the substrate,

wherein a portion of the first solid electrolyte layer is filled in the third through-hole of the first lower electrode layer, and

wherein a portion of the second solid electrolyte layer is filled in the fourth through-hole of the second lower electrode layer.

2. The solid electrolyte integrated device according to claim 1 ,

wherein the first lower electrode layer has a first region that is covered by the first solid electrolyte layer, and a second region that is not covered by the first solid electrolyte layer, and

wherein the second region of the first lower electrode layer is electrically connected to the second upper electrode layer.

3. The solid electrolyte integrated device according to claim 2 , wherein the portion including the second region of the first lower electrode layer is covered by the second upper electrode layer.

4. The solid electrolyte integrated device according to claim 2 , wherein a portion of a side surface of the second solid electrolyte layer is covered by the second upper electrode layer.

5. The solid electrolyte integrated device according to claim 1 ,

wherein the first solid electrolyte layer and the second solid electrolyte layer are electrically connected in series via the first lower electrode layer and the second upper electrode layer, and

wherein the second upper electrode layer extends from an upper portion of one end of the second solid electrolyte layer to an upper portion of one end of the first lower electrode layer.

6. The solid electrolyte integrated device according to claim 1 , further comprising:

a first additional electrode layer disposed in the first through-hole near the first opening and electrically connected to the first lower electrode layer; and

a second additional electrode layer disposed in the second through-hole near the second opening, and electrically connected to the second lower electrode layer.

7. The solid electrolyte integrated device according to claim 1 ,

wherein the first upper electrode layer has a fifth through-hole formed in the vertical direction, a normal line that is perpendicular to the first main surface and passing through the third through-hole of the first lower electrode layer passing through the fifth through-hole, and

wherein the second upper electrode layer has a sixth through-hole formed in the vertical direction, a normal line that is perpendicular to the first main surface and passing through the fourth through-hole of the second lower electrode layer passing through the sixth through-hole.

8. The solid electrolyte integrated device according to claim 1 ,

wherein the first solid electrolyte layer covers a portion of a top surface to a portion of a side surface of the first lower electrode layer, and

wherein the second solid electrolyte layer covers a portion of a top surface to a portion of a side surface of the second lower electrode layer.

9. The solid electrolyte integrated device according to claim 8 ,

wherein the first upper electrode layer covers a portion of a top surface to a portion of a side surface of the first solid electrolyte layer, and

wherein the second upper electrode layer covers a portion of a top surface to a portion of a side surface of the second solid electrolyte layer.

10. The solid electrolyte integrated device according to claim 1 , wherein the substrate is formed of glass.

11. The solid electrolyte integrated device according to claim 1 , wherein the substrate is a silicon substrate, on an outer surface of which silicon oxide is disposed.

Assignments (2)
CHANGE OF NAME Recorded Mar 31, 2026
From: MITSUI MINING AND SMELTING COMPANY, LIMITED
To: MITSUI KINZOKU COMPANY, LIMITED
Reel/Frame 075357/0342 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 22, 2019
From: IDE, SHINGO; YASHIMA, ISAMU; KUME, KENJI
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 050791/0457 →
Priority Claims (1)
JP PCT/JP2017/014709 · Apr 10, 2017 · national
Continuity (1)
Related Publication 20200067135A1 · Feb 27, 2020