Method for producing bonding composition
A method is provided for producing a bonding composition containing copper particles and a second liquid medium. In this production method, the copper particles are produced in a first liquid medium using a wet reduction method, and thus a dispersion of the copper particles is prepared. Subsequently, the first liquid medium in the dispersion is ultimately, finally or eventually replaced with the second liquid medium while the dispersion is kept wet. It is also preferable that the first liquid medium is replaced with another liquid medium one or more times, and the second liquid medium is used in the final replacement. The liquid media are preferably replaced at a temperature of lower than 100° C. The second liquid medium preferably includes one or more of water, alcohol, ketone, ester, ether, and hydrocarbon.
1. A method for producing a bonding composition, comprising:
producing copper particles in a first liquid medium using a wet reduction method, thereby preparing a dispersion of the copper particles; and
ultimately, finally or eventually replacing the first liquid medium in the dispersion with a second liquid medium while keeping the dispersion wet, thereby obtaining a bonding composition containing the copper particles and the second liquid medium,
wherein the method is performed in the absence of an organic polymer.
2. The method for producing a bonding composition according to claim 1 , wherein the first liquid medium is replaced at a temperature of lower than 100° C.
3. The method for producing a bonding composition according to claim 1 , wherein the second liquid medium comprises one or more of water, alcohol, ketone, ester, ether, and hydrocarbon.
4. The method for producing a bonding composition according to claim 1 , wherein the copper particles have a volume cumulative particle size D SEM50 of 100 to 300 nm, D SEM50 being at a cumulative volume of 50 vol % as measured with a scanning electron microscope.
5. The method for producing a bonding composition according to claim 1 , wherein the first liquid medium is replaced with another liquid medium one or more times, and the second liquid medium is used in a final replacement.
6. The method for producing a bonding composition according to claim 5 , wherein the first liquid medium is replaced with another liquid medium while the dispersion is kept wet.
7. A method for producing conductive paste comprising the bonding composition obtained using the method for producing a bonding composition according to claim 1 .
8. A method for bonding materials to be bonded, wherein the bonding composition obtained using the method for producing a bonding composition according to claim 1 is placed between two materials to be bonded.