Wiring board manufacturing method
Provided is a method of manufacturing a circuit board involves: preparing a composite laminate including a support, a release layer, and a multilayered circuit board; disposing the composite laminate on a stage such that one face of the composite laminate is put into tight contact with the stage; and releasing the support or the multilayered circuit board from the release layer such that the support or the multilayered circuit board forms a convex face with a curvature radius of 200 to 5000 mm while the face of the composite laminate is kept in tight contact with the stage. The method according to the present invention can prevent the occurrences of defects, for example, breaking in the support and cracking and wire disconnections in the multilayered circuit board in manufacturing of circuit boards, such as coreless circuit boards, and ensure stable release of the support or the multilayered circuit board.
1. A method of manufacturing a circuit board, comprising:
(a) preparing a composite laminate comprising, in sequence,
a support,
an adhesive metal layer composed of at least one metal selected from the group consisting of Ti, Cr, and Ni,
an auxiliary release layer composed of copper,
a release layer, and
a multilayered circuit board;
(b) disposing the composite laminate on a stage such that one face of the composite laminate is put into tight contact with the stage; and
(c) releasing the support or the multilayered circuit board from the release layer such that the support or the multilayered circuit board forms a convex face with a curvature radius of 1500 to 5000 mm while the face of the composite laminate is kept in tight contact with the stage.
2. The method according to claim 1 , wherein (c) comprises putting a cylindrical head into contact with another face, remote from the stage, of the composite laminate.
3. The method according to claim 2 , wherein (c) comprises:
putting one end of the other face, remote from the stage, of the composite laminate into tight contact with the cylindrical head; and thereafter
rolling the cylindrical head on the composite laminate to increase an area of the composite laminate in tight contact with the cylindrical head thereby releasing the support or the multilayered circuit board from the release layer.
4. The method according to claim 3 , wherein a releasing rate for releasing the support or the multilayered circuit board from the release layer in (c) is 0.01 to 2.0 m/s.
5. The method according to claim 2 , wherein (c) further comprises:
disposing a roller between the support and the multilayered circuit board at one end of the composite laminate; and thereafter
rolling the cylindrical head and the roller synchronously to release the support or the multilayered circuit board from the release layer.
6. The method according to claim 5 , wherein a releasing rate for releasing the support or the multilayered circuit board from the release layer in (c) is 0.01 to 2.0 m/s.
7. The method according to claim 2 , wherein a releasing rate for releasing the support or the multilayered circuit board from the release layer in (c) is 0.01 to 2.0 m/s.
8. The method according to claim 1 , wherein a releasing rate for releasing the support or the multilayered circuit board from the release layer in (c) is 0.01 to 2.0 m/s.