Surface-treated copper foil, method for producing same, copper-clad laminate for printed wiring board, and printed wiring board
There is provided a surface-treated copper foil including a surface coating layer provided on at least one surface of a copper foil, the surface coating layer being mainly composed of silicon with a hydrogen content of 1 to 35 atomic % and/or a carbon content of 1 to 15 atomic %. This foil can be manufactured by forming a surface coating layer composed mainly of silicon with the above hydrogen and carbon contents on at least one surface of the copper foil by PVD or CVD. The present invention can provide a copper foil with a surface coating layer that can achieve a high bonding strength to a resin layer even if the copper foil has an extremely smooth surface such as one formed by vapor deposition, for example, sputtering and also has a desirable insulation resistance suitable for achieving a fine pitch in a printed wiring board.
1. A surface-treated copper foil comprising:
a copper foil; and
a surface coating layer provided on at least one surface of the copper foil, the surface coating layer consists of amorphous silicon, hydrogen, carbon, and incidental impurities, and has an amorphous silicon content of 70.7 to 90 atomic %, a hydrogen content of 1 to 35 atomic %, and a carbon content of 1 to 15 atomic %,
wherein the surface coating layer has a thickness of 0.1 to 100 nm.
2. The surface-treated copper foil according to claim 1 , for use in manufacturing of a copper-clad laminate for a printed wiring board, wherein the manufacturing involves laminating a resin layer on the surface coating layer.
3. The surface-treated copper foil according to claim 1 , wherein the surface, on a side of the surface coating layer, of the copper foil has an arithmetic average roughness Ra of 100 nm or less measured in accordance with JIS B 0601-2001.
4. The surface-treated copper foil according to claim 1 , wherein the surface coating layer has a hydrogen content of 10 to 30 atomic %.
5. The surface-treated copper foil according to claim 1 , wherein the surface coating layer has a carbon content of 3 to 13 atomic %.
6. The surface-treated copper foil according to claim 1 , wherein the copper foil has a thickness of 50 to 1000 nm.
7. A copper-clad laminate for a printed wiring board comprising the surface-treated copper foil according to claim 1 and a resin layer in close contact with the surface coating layer.
8. A method of manufacturing a printed wiring board, wherein the printed wiring board is manufactured using the surface-treated copper foil according to claim 1 .
9. A method for manufacturing a surface-treated copper foil according to claim 1 , comprising the steps of:
providing a copper foil; and
forming a surface coating layer having a thickness of 0.1 to 100 nm on at least one surface of the copper foil by physical vapor deposition or chemical vapor deposition, the surface coating layer consisting of amorphous silicon, hydrogen, carbon, and incidental impurities, and has an amorphous silicon content of 70.7 to 90 atomic %, a hydrogen content of 1 to 35 atomic %, and a carbon content of 1 to 15 atomic %.
10. The method according to claim 9 , wherein the surface coating layer is formed by physical vapor deposition wherein the physical vapor deposition is performed by sputtering.
11. The method according to claim 9 , wherein the physical vapor deposition is performed with at least one additive component containing a carbon source and a hydrogen source using a silicon target and/or silicon carbide target under a non-oxidizing atmosphere.
12. The method according to claim 11 , wherein the additive component comprises at least one gas selected from the group consisting of methane, ethane, propane, butane, acetylene, and tetraethoxysilane.