Patent Assignment
Reel/Frame 040078/0948
Assignment of Assignor's Interest
Recorded: 2016-10-20
Pages: 3
Assignors
MATSUURA, YOSHINORI
Executed: 2016-09-27
NISHIKAWA, JOE
Executed: 2016-09-28
KURIHARA, HIROAKI
Executed: 2016-09-26
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1, OSAKI, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property
(1)
Surface-Treated Copper Foil, Method for Producing Same, Copper-Clad Laminate for Printed Wiring Board, and Printed Wiring Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.