Production method for printed wiring board having dielectric layer
A production method includes: preparing a metal clad laminate including a dielectric layer≤30 μm thick, a first metal foil on a first surface of the dielectric layer, a second metal foil on a second surface of the dielectric layer, first and second carriers on the metal foil via a releasable layer; arranging the pair of metal clad laminates on a resin substrate so the first carrier of each metal clad laminate faces the resin substrate on each surface of the resin substrate; releasing the second carrier from a laminated member to expose the second metal foil; forming a pattern on the second metal foil; arranging an insulating layer on the pattern and arranging a metal layer on the insulating layer; and separating the first carrier and the first metal foil from each other. The dielectric layer has a strain energy at break of 1.8 MJ or less.
1. A laminated member comprising: a resin substrate; and a pair of metal clad laminates,
the metal clad laminate comprising: a dielectric layer having a thickness of 30 μm or less and a strain energy at break of 1.8 MJ or less; a first metal foil arranged on a first surface of the dielectric layer; a second metal foil arranged on a second surface of the dielectric layer; a first carrier arranged on the first metal foil via a releasable layer; and a second carrier arranged on the first metal foil via a releasable layer,
the pair of metal clad laminates being arranged on the resin substrate in such a manner that the first carrier of each metal clad laminate faces each surface of the resin substrate.
2. The laminated member according to claim 1 , wherein the dielectric layer has a tensile strength of 60.0 MPa or less, and a tensile elongation at break of 5.0% or less.
3. The laminated member according to claim 1 , wherein the dielectric layer has a thickness variation of ±15% or less.
4. The laminated member according to claim 1 , wherein the dielectric layer has a relative dielectric constant of 10 or more.
5. The laminated member according to claim 1 , wherein the dielectric layer contains dielectric particles in the dielectric layer.
6. The laminated member according to claim 1 , wherein the dielectric layer contains dielectric particles in an amount of 60 mass % or more and 95% or less in the dielectric layer.
7. A method for producing a printed wiring board which includes a dielectric layer having a thickness of 30 μm or less,
the method comprising:
preparing a metal clad laminate comprising: a dielectric layer; a first metal foil arranged on a first surface of the dielectric layer; a second metal foil arranged on a second surface of the dielectric layer; a first carrier arranged on the first metal foil via a releasable layer; and a second carrier arranged on the second metal foil via a releasable layer;
forming, using the pair of metal clad laminates, a laminated member by arranging the metal clad laminates on both surfaces of a resin substrate, respectively, in such a manner that the first carrier of each metal clad laminate faces the resin substrate;
releasing the second carrier from the laminated member so as to expose the second metal foil;
etching the exposed second metal foil to form a conductor pattern;
arranging an insulating layer on the conductor pattern and arranging a metal layer onto the insulating layer; and then
separating the first carrier and the first metal foil from each other in the laminated member,
wherein the dielectric layer has a strain energy at break of 1.8 MJ or less.
8. The method for producing a printed wiring board according to claim 7 , wherein the dielectric layer has a tensile strength of 60.0 MPa or less and a tensile elongation at break of 5.0% or less.
9. The method for producing a printed wiring board according to claim 8 , wherein a dielectric layer that has a thickness variation of ±15% or less is used as the dielectric layer.
10. The method for producing a printed wiring board according to claim 8 , wherein a dielectric layer that has a relative dielectric constant of 10 or more is used as the dielectric layer.
11. The method for producing a printed wiring board according to claim 8 , wherein a dielectric layer containing dielectric particles therein is used as the dielectric layer.
12. The method for producing a printed wiring board according to claim 8 , wherein a dielectric layer containing dielectric particles in an amount of 60 mass % or more and 95% or less therein is used as the dielectric layer.
13. The method for producing a printed wiring board according to claim 7 , wherein a dielectric layer that has a thickness variation of ±15% or less is used as the dielectric layer.
14. The method for producing a printed wiring board according to claim 13 , wherein a dielectric layer that has a relative dielectric constant of 10 or more is used as the dielectric layer.
15. The method for producing a printed wiring board according to claim 13 , wherein a dielectric layer containing dielectric particles therein is used as the dielectric layer.
16. The method for producing a printed wiring board according to claim 13 , wherein a dielectric layer containing dielectric particles in an amount of 60 mass % or more and 95% or less therein is used as the dielectric layer.
17. The method for producing a printed wiring board according to claim 7 , wherein a dielectric layer that has a relative dielectric constant of 10 or more is used as the dielectric layer.
18. The method for producing a printed wiring board according to claim 17 , wherein a dielectric layer containing dielectric particles therein is used as the dielectric layer.
19. The method for producing a printed wiring board according to claim 7 , wherein a dielectric layer containing dielectric particles therein is used as the dielectric layer.
20. The method for producing a printed wiring board according to claim 7 , wherein a dielectric layer containing dielectric particles in an amount of mass % or more and 95% or less therein is used as the dielectric layer.