Copper-clad laminate plate and printed wiring board
Provided is a copper-clad laminate in which a copper foil and a resin are joined together with high heat-resistant adhesion force though a fluororesin is used. This copper-clad laminate includes a surface-treated copper foil including a copper foil and a zinc-containing layer on at least one surface of the copper foil; and a sheet-shaped fluororesin on the zinc-containing layer side of the surface-treated copper foil. The zinc-containing layer is composed of Zn and a transition element M having a melting point of 1200° C. or more. When the interface between the copper foil and the zinc-containing layer is subjected to elemental analysis by GD-OES, the emission intensity ratio I Zn /I Cu of the emission intensity of Zn to that of Cu is 3.0×10 −3 or less, and the emission intensity ratio I Zn /I M of the emission intensity of Zn to that of the transition element M is 0.30 to 0.50.
1. A copper-clad laminate comprising:
a surface-treated copper foil comprising a copper foil and a zinc-containing layer provided on at least one surface of the copper foil; and
a sheet-shaped fluororesin provided on the zinc-containing layer side of the surface-treated copper foil,
wherein the zinc-containing layer is composed of Zn and a transition element M having a melting point of 1200° C. or more, and
wherein when an interface between the copper foil and the zinc-containing layer is subjected to elemental analysis by glow discharge optical emission spectrometry (GD-OES), an emission intensity ratio I Zn /I Cu , which is a ratio of an emission intensity of Zn referred to as I Zn to an emission intensity of Cu referred to as I Cu , is 3.0×10 −3 or less, and an emission intensity ratio I Zn /I M , which is a ratio of an emission intensity of Zn referred to as I Zn to an emission intensity of the transition element M referred to as I M , is 0.30 or more and 0.50 or less.
2. The copper-clad laminate according to claim 1 , wherein the transition element M is at least one selected from the group consisting of Co, Fe, Ni, Mo, and W.
3. The copper-clad laminate according to claim 1 , wherein the transition element M is Ni and/or Mo.
4. The copper-clad laminate according to claim 1 , wherein the emission intensity ratio I Zn /I Cu is 1.5×10 −3 or more and 3.0×10 −3 or less.
5. The copper-clad laminate according to claim 1 , wherein the emission intensity ratio I Zn /I M is 0.30 or more and 0.45 or less.
6. The copper-clad laminate according to claim 1 , wherein the emission intensity ratio I Zn /I M is 0.35 or more and 0.45 or less.
7. The copper-clad laminate according to claim 1 , wherein the fluororesin is at least one selected from the group consisting of polytetrafluoroethylene, a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, a tetrafluoroethylene-hexafluoropropylene copolymer, and a tetrafluoroethylene-ethylene copolymer.
8. The copper-clad laminate according to claim 1 , wherein a surface of the copper foil on the zinc-containing layer side is a roughening-treated surface.
9. A printed wiring board manufactured using the copper-clad laminate according to claim 1 .