IP Library Assignment 062373/0202
Patent Assignment
Reel/Frame 062373/0202

Assignment of Assignor's Interest

Recorded: 2023-01-13 Pages: 5
Assignors
NAKAJIMA, DAISUKE
Executed: 2022-12-12
KAWAGUCHI, SHOTA
Executed: 2022-12-12
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property (1)
Copper-Clad Laminate Plate and Printed Wiring Board
Application: 18/016,120 →
Publication: US 2023/0276571
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 31, 2026
From: MITSUI MINING AND SMELTING COMPANY, LIMITED
To: MITSUI KINZOKU COMPANY, LIMITED
Reel/Frame 075357/0342 →