IP Library Granted Patent US 10,244,635
Granted Patent B2
US 10,244,635 · App. 15/570,846 · Granted Mar 26, 2019

Production method for copper-clad laminate plate

Inventors: Ayumu Tateoka (Ageo, JP); Makoto Hosokawa (Ageo, JP); Shota Kawaguchi (Ageo, JP)
Assignee: MITSUI MINING & SMELTING CO., LTD.
H05K3/022B32B7/12B32B15/08B32B15/085B32B27/322B32B37/144B32B38/0012C23C22/52C23C22/63C25D1/04H05K3/385H05K3/389B29C66/45B29C66/472B29C66/7352B29C66/7392B32B15/20B32B2255/24B32B2309/105B32B2327/18B32B2398/20B32B2457/08C25D3/38H05K2203/0307
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,244,635
App. No.
15/570,846
Granted
Mar 26, 2019
Kind
B2
Abstract

There is provided a method of producing a copper clad laminate having a copper foil and a resin bonded at high adhesive force despite the use of a thermoplastic resin having a low dielectric constant. This method includes the steps of: providing a roughened copper foil having at least one roughened surface having fine irregularities composed of acicular crystals containing cupric oxide and cuprous oxide; and bonding a sheet-shaped thermoplastic resin to the roughened surface of the roughened copper foil to provide a copper clad laminate. The roughened surface has a cupric oxide thickness of 1 to 20 nm and a cuprous oxide thickness of 15 to 70 nm, both determined by sequential electrochemical reduction analysis (SERA) at the time of bonding the thermoplastic resin.

Claims (11)

1. A method of producing a copper clad laminate, comprising:

providing a roughened copper foil having at least one roughened surface having irregularities composed of acicular crystals containing cupric oxide and cuprous oxide, and

bonding a sheet-shaped thermoplastic resin to the roughened surface of the roughened copper foil to provide a copper clad laminate,

wherein the roughened surface has a cupric oxide thickness of 1 to 20 nm and a cuprous oxide thickness of 15 to 70 nm, both determined by sequential electrochemical reduction analysis (SERA) at the time of bonding the thermoplastic resin.

2. The method according to claim 1 , wherein the acicular crystals have a height of 50 to 400 nm.

3. The method according to claim 1 , wherein the thermoplastic resin is at least one resin selected from the group consisting of polysulfones, polyethersulfones, amorphous polyarylates, liquid crystal polymers, polyether ether ketones, thermoplastic polyimides, polyamide-imides, fluororesins, polyamides, nylons, polyacetals, modified polyphenylene ethers, polyethylene terephthalate, glass fiber reinforced polyethylene terephthalate, and cycloolefins.

4. The method according to claim 1 , wherein the thermoplastic resin is at least one resin selected from the group consisting of polysulfones, polyethersulfones, amorphous polyarylates, liquid crystal polymers, polyether ether ketones, thermoplastic polyimides, polyamide-imides, and fluororesins.

5. The method according to claim 1 , wherein the thermoplastic resin is a fluororesin, and the fluororesin is at least one selected from the group consisting of polytetrafluoroethylene, tetrafluoroethylene-perfluoroalkylvinylether copolymers, tetrafluoroethylene-hexafluoropropylene copolymers, and tetrafluoroethylene-ethylene copolymers.

6. The method according to claim 1 , wherein the roughened copper foil has an organic rust-proof layer on the roughened surface.

7. The method according to claim 6 , wherein the organic rust-proof layer contains at least one of a triazole compound and a silane coupling agent.

8. The method according to claim 6 , wherein the organic rust-proof layer comprises a triazole compound.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2019
From: MITSUI MINING & SMELTING CO., LTD.
To: NAMICS CORPORATION
Reel/Frame 048967/0794 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 31, 2017
From: TATEOKA, AYUMU; HOSOKAWA, MAKOTO; KAWAGUCHI, SHOTA
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 043992/0509 →
Priority Claims (2)
JP 2016-040795 · Mar 3, 2016 · national
WO PCT/JP2016/082658 · Nov 2, 2016 · international
Continuity (1)
Related Publication 20180139848A1 · May 17, 2018