Production method for multilayer wiring board
A method of manufacturing a multilayer wiring board is disclosed, the method being capable of reinforcing the multilayer wiring layer and thereby improving the reliability of connection and the flatness on the surface of the multilayer wiring layer. The method includes providing a laminated sheet having a substrate, a first release layer and a metal layer; forming a first wiring layer on the metal layer; alternately stacking insulating layers and wiring layers on the laminated sheet on which the first wiring layer is formed to give a laminate provided with a multilayer wiring layer; stacking a reinforcing sheet on the laminate provided with the multilayer wiring layer at the side opposite to the laminate sheet, while interposing the second release layer; separating the substrate from the metal layer; and separating the reinforcing sheet from the laminate provided with the multilayer wiring layer to give the multilayer wiring board.
1. A method of manufacturing a multilayer wiring board, the method comprising:
providing a laminated sheet including, in sequence, a substrate, a first release layer, and a metal layer;
forming a first wiring layer on the metal layer;
alternately stacking insulating layers and wiring layers on the laminated sheet on which the first wiring layer is formed to give a laminate provided with a multilayer wiring layer, the first wiring layer being incorporated in the form of an embedded wiring layer;
stacking a reinforcing sheet having a lower Vickers hardness than that of the substrate on the laminate provided with the multilayer wiring layer at the side opposite to the laminated sheet, while interposing a second release layer;
separating the substrate from the metal layer at the first release layer; and
separating the reinforcing sheet from the laminate provided with the multilayer wiring layer at the second release layer to give the multilayer wiring board,
wherein the substrate is composed of glass.
2. The method according to claim 1 , further comprising:
removing the metal layer by etching after separating the substrate and before separating the reinforcing sheet.
3. The method according to claim 1 , wherein a rate of the Vickers hardness of the reinforcing sheet to the Vickers hardness of the substrate is 2 to 99%.
4. The method according to claim 1 , wherein a rate of the Vickers hardness of the reinforcing sheet to the Vickers hardness of the substrate is 6 to 90%.
5. The method according to claim 1 , wherein a rate of the Vickers hardness of the reinforcing sheet to the Vickers hardness of the substrate is 10 to 85%.
6. The method according to claim 1 , wherein the reinforcing sheet exhibits a Vickers hardness of 50 to 700 HV and the substrate exhibits a Vickers hardness of 500 to 3000 HV.
7. The method according to claim 1 , wherein the reinforcing sheet exhibits a Vickers hardness of 150 to 550 HV and the substrate exhibits a Vickers hardness of 550 to 2500 HV.
8. The method according to claim 1 , wherein the reinforcing sheet exhibits a Vickers hardness of 200 to 500 HV and the substrate exhibits a Vickers hardness of 600 to 2000 HV.
9. The method according to claim 1 , wherein the reinforcing sheet has a spring deflection limit Kb 0.1 of 100 to 1500 N/mm 2 as measured in accordance with JIS H 3130:2012.
10. The method according to claim 1 , wherein the reinforcing sheet has a spring deflection limit Kb 0.1 of 150 to 1200 N/mm 2 as measured in accordance with JIS H 3130:2012.
11. The method according to claim 1 , wherein the reinforcing sheet has a spring deflection limit Kb 0.1 of 200 to 1000 N/mm 2 as measured in accordance with JIS H 3130:2012.
12. The method according to claim 1 , further comprising
removing the metal layer by etching after separating the substrate and before separating the reinforcing sheet; and
mounting an electronic device on a surface of the first wiring layer after removing the metal layer and before separating the reinforcing sheet.