Copper foil with carrier, coreless support with wiring layer, and method for producing printed circuit board
There is provided a copper foil provided with a carrier exhibiting a high peeling resistance against the developer in the photoresist developing process and achieving high stability of mechanical peel strength of the carrier. The copper foil provided with a carrier comprises a carrier; an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu; a release layer disposed on the interlayer; and an extremely-thin copper layer disposed on the release layer.
1. A method for manufacturing a printed wiring board, the method comprising:
providing a copper foil including a carrier as a support; wherein the copper foil provided with a carrier comprises:
a carrier;
an interlayer disposed on the carrier, the interlayer containing at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W, and Ni;
a release layer disposed on the interlayer;
an extremely-thin copper layer disposed on the release layer;
and an antireflective layer disposed between the release layer and the extremely-thin copper layer,
forming a wiring layer on a surface of the extremely-thin copper layer to prepare a coreless support including a wiring layer;
forming a build-up layer on a surface having the wiring layer of the coreless support including the wiring layer;
mounting an electronic element on the coreless support to prepare a laminate;
separating the laminate to prepare a multilayer wiring board including the build-up layer;
performing selective etching of the antireflective layer to expose a wiring layer of the multilayer wiring board; and
providing an outer layer pad on a surface of the wiring layer.
2. The method for manufacturing a printed wiring board according to claim 1 , wherein the carrier is composed of glass or ceramics.
3. The method for manufacturing a printed wiring board according to claim 1 , wherein each of the interlayer, the release layer, and the extremely-thin copper layer are formed by sputtering.