IP Library Assignment 050761/0701
Patent Assignment
Reel/Frame 050761/0701

Assignment of Assignor's Interest

Recorded: 2019-10-18 Pages: 4
Assignor
MATSUURA, YOSHINORI
Executed: 2018-06-27
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property (1)
Copper Foil with Carrier, Coreless Support with Wiring Layer, and Method for Producing Printed Circuit Board
Application: 16/657,084 →
Publication: US 2020/0053885
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 31, 2026
From: MITSUI MINING AND SMELTING COMPANY, LIMITED
To: MITSUI KINZOKU COMPANY, LIMITED
Reel/Frame 075357/0342 →