IP Library Granted Patent US 12,331,182
Granted Patent B2
US 12,331,182 · App. 17/442,330 · Granted Jun 17, 2025

Resin composition and resin-attached copper foil

Inventors: Kazuhiro Oosawa (Ageo, JP); Haruka Makino (Ageo, JP); Kuniharu Ogawa (Ageo, JP)
Assignee: MITSUI MINING & SMELTING CO., LTD.
C08L23/0869B05D7/26B32B17/10C08L33/064B05D2202/45B05D2203/35C08L2201/10C08L2205/035C08L2312/06
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Quick Facts
Patent No.
US 12,331,182
App. No.
17/442,330
Granted
Jun 17, 2025
Kind
B2
Abstract

There is provided a resin composition including (a) an acrylic polymer having a tensile modulus of 200 MPa or less, (b) a resin that is solid at 25° C., (c) a resin that is liquid at 25° C. and crosslinkable with at least one of the component (a) or the component (b), and (d) a polymerization initiator. The content of the component (a) is 35 parts by weight or more and 93 parts by weight or less, the content of the component (b) is 3 parts by weight or more and 60 parts by weight or less, and the content of the component (c) is 1 part by weight or more and 25 parts by weight or less, based on 100 parts by weight of the total amount of the component (a), the component (b), and the component (c).

Claims (22)

1. A resin composition comprising the following components:

(a) an acrylic polymer having a tensile modulus of 200 MPa or less as measured in accordance with JIS K7161-1:2014;

(b) a resin that is solid at 25° C.;

(c) a resin that is liquid at 25° C. and crosslinkable with at least one of the component (a) and the component (b); and

(d) a polymerization initiator,

wherein the resin composition contains

the component (a) in an amount of 35 parts by weight or more and 93 parts by weight or less,

the component (b) in an amount of 3 parts by weight or more and 60 parts by weight or less, and

the component (c) in an amount of 1 part by weight or more and 25 parts by weight or less,

based on 100 parts by weight of a total amount of the component (a), the component (b), and the component (c);

wherein a weight ratio of the component (c) to the component (d) is 700 or more and 5000 or less; and

wherein the resin composition has transparency after curing.

2. The resin composition according to claim 1 , having a weight ratio of the component (a) to the component (b), a/b, of 0.6 or more and 18 or less.

3. The resin composition according to claim 1 , having a weight ratio of the component (c) to the component (d), c/d, of 800 or more and 5000 or less.

4. The resin composition according to claim 1 , wherein at least one of the component (a) or the component (b) has a carboxyl group, and the component (c) is a liquid alicyclic epoxy compound.

5. The resin composition according to claim 1 , having an elongation at break of 200% or more as measured in accordance with JIS K7161-1:2014 after curing.

6. A resin-attached copper foil comprising:

a copper foil including a smooth surface; and

the resin composition according to claim 1 provided on the smooth surface.

7. A composite material comprising:

a glass substrate; and

the resin composition according to claim 1 provided on at least one surface of the glass substrate.

Assignments (2)
CHANGE OF NAME Recorded Mar 31, 2026
From: MITSUI MINING AND SMELTING COMPANY, LIMITED
To: MITSUI KINZOKU COMPANY, LIMITED
Reel/Frame 075357/0342 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2021
From: OOSAWA, KAZUHIRO; MAKINO, HARUKA; OGAWA, KUNIHARU
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 057579/0593 →
Priority Claims (1)
JP 2019-063436 · Mar 28, 2019 · national
Continuity (1)
Related Publication 20220169842A1 · Jun 2, 2022
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