Patent Assignment
Reel/Frame 045308/0469
Assignment of Assignor's Interest
Recorded: 2018-03-22
Pages: 4
Assignor
OAK-MITSUI, INC.
Executed: 2017-10-01
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI,, SHINAGAWA-KU,, 141-8584, JAPAN
Covered Properties
(10)
Improved Method for Forming Conductive Traces and Printed Circuits Made Thereby
Patent:
6,117,300 →
Application:
09/113,043 →
Process to Manufacturing Tight Tolerance Embedded Elements for Printed Circuit Boards
Patent:
6,606,792 →
Application:
09/578,424 →
Formation of an Embedded Capacitor Plane Using a Thin Dielectric
Patent:
6,657,849 →
Application:
09/644,959 →
Substrate Adhesion Enhancement to Film
Nickel Coated Copper as Electrodes for Embedded Passive Devices
Novel Thin Laminate as Embedded Capacitance Material in Printed Circuit Boards
Multilayered Construction for Resistor and Capacitor Formation
Method of Making Multilayered Construction for Use in Resistors and Capacitors
Polymer-Ceramic Composites with Excellent Tcc
Multilayered Construction for Use in Resistors and Capacitors
Related Assignments
(12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 31, 1998
From: CARBIN, DEREK; HERRICK, WENDY A.
To: OAK-MITSUI, INC
Reel/Frame 009422/0691 →
Assignment of Assignor's Interest
May 25, 2000
From: ANDRESAKIS, JOHN A.
To: OAK-MITSUI, INC.
Reel/Frame 010853/0918 →
Assignment of Assignor's Interest
May 1, 2001
From: SKORUPSKI, EDWARD C.; GRAY, JEFFREY T.; ANDRESAKIS, JOHN A.; HERRICK, WENDY
To: OAK-MITSUI, INC.
Reel/Frame 011771/0318 →
Assignment of Assignor's Interest
Jan 3, 2002
From: ANDRESAKIS, JOHN A.; SKORUPSKI, EDWARD; HERRICK, WENDY; WOODRY, MICHAEL
To: OAK-MITSUI, INC.
Reel/Frame 012426/0400 →
Assignment of Assignor's Interest
Aug 4, 2003
From: ANDRESAKIS, JOHN; SKORUPSKI, EDWARD C.; ZIMMERMAN, SCOTT; SMITH, GORDON
To: OAK-MITSUI, INC.
Reel/Frame 014349/0697 →
Assignment of Assignor's Interest
Feb 19, 2004
From: PRAMANIK, PRANABES K.
To: OAK-MITSUI INC.
Reel/Frame 015010/0580 →
Assignment of Assignor's Interest
May 9, 2005
From: ANDRESAKIS, JOHN A.; PRAMANIK, PRANABES K.
To: OAK-MITSUI INC.
Reel/Frame 016552/0417 →
Assignment of Assignor's Interest
May 20, 2005
From: ANDRESAKIS, JOHN A.; PRAMANIK, PRANABES K.; MAHLER, BRUCE; BRANDLER, DANIEL
To: OAK-MITSUI INC.; OHMEGA TECHNOLOGIES INC.
Reel/Frame 016625/0021 →
Assignment of Assignor's Interest
Oct 12, 2007
From: PRAMANIK, PRANABES K.; RADEWITZ, JACLYN; YAMAZAKI, KAZUHIRO
To: OAK-MITSUI INC.
Reel/Frame 019959/0852 →
Patent Security Agreement
Dec 28, 2020
From: OHMEGA TECHNOLOGIES, LLC
To: ADAMS STREET CREDIT ADVISORS LP, AS COLLATERAL AGENT
Reel/Frame 054859/0966 →
Release of Security Interest
Feb 27, 2025
From: ADAMS STREET CREDIT ADVISORS LP, AS ADMINISTRATIVE AGENT
To: OHMEGA TECHNOLGIES, LLC
Reel/Frame 070355/0589 →
Change of Name
Mar 31, 2026
From: MITSUI MINING AND SMELTING COMPANY, LIMITED
To: MITSUI KINZOKU COMPANY, LIMITED
Reel/Frame 075357/0342 →