Double-sided copper-clad laminate
There is provided a double-sided copper-clad laminate for forming a capacitor that can exhibit excellent properties in voltage endurance and peel strength, while ensuring high capacitor capacity, when used as a capacitor. This double-sided copper-clad laminate includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.
1. A double-sided copper-clad laminate comprising an adhesive layer and a copper foil in order on each of both surfaces of a resin film,
wherein the resin film is in a cured state at 25° C., and
wherein each of the copper foils has a root mean square gradient Sdq of 0.01 or more and 2.3 or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.
2. The double-sided copper-clad laminate according to claim 1 , wherein a combination of the adhesive layers and the resin film has a relative dielectric constant of 2.5 or more and 30 or less at a frequency of 1 MHz in a cured state.
3. The double-sided copper-clad laminate according to claim 1 , wherein the resin film has a relative dielectric constant of 2 or more and 30 or less at a frequency of 1 MHz in a cured state.
4. The double-sided copper-clad laminate according to claim 1 , wherein the adhesive layers have a relative dielectric constant of 2.5 or more and 30 or less at a frequency of 1 MHz in a cured state.
5. The double-sided copper-clad laminate according to claim 1 , wherein the resin film has a thickness of 0.5 μm or more and 30 μm or less.
6. The double-sided copper-clad laminate according to claim 1 , wherein the resin film comprises at least one selected from the group consisting of epoxy resins, polyethylene terephthalate, polyethylene naphthalate, polyvinylcarbazole, polyphenylene sulfide, polyimides, polyamides, aromatic polyamides, polyamide-imides, polyethersulfone, polyethernitrile, polyetheretherketone, and polytetrafluoroethylene.
7. The double-sided copper-clad laminate according to claim 1 , wherein the adhesive layers comprise a resin component composed of a thermoplastic component and/or a thermosetting component, and the resin component comprises at least one selected from the group consisting of epoxy resins, polyethylene terephthalate resins, polyethylene naphthalate resins, polyvinylcarbazole resins, polyphenylene sulfide resins, polyamide resins, aromatic polyamide resins, polyamide-imide resins, polyimide resins, polyethersulfone resins, polyethernitrile resins, polyetheretherketone resins, polytetrafluoroethylene resins, urethane resins, isocyanate resins, active ester resins, phenolic resins, and diamine compounds.
8. The double-sided copper-clad laminate according to claim 1 , wherein the adhesive layers further comprise a dielectric filler being a complex metal oxide containing at least two selected from the group consisting of Ba, Ti, Sr, Pb, Zr, La, Ta, Ca, and Bi.
9. The double-sided copper-clad laminate according to claim 8 , wherein the complex metal oxide comprises at least one selected from the group consisting of BaTiO 3 , SrTiO 3 , Pb(Zr,Ti)O 3 , PbLaTiO 3 , PbLaZrO, and SrBi 2 Ta 2 O 9 .
10. The double-sided copper-clad laminate according to claim 1 , wherein each of the copper foils has a kurtosis Sku of 2.6 or more and 4.0 or less as measured in accordance with ISO 25178 on the surface on the side being in contact with the adhesive layer.
11. The double-sided copper-clad laminate according to claim 1 , wherein peel strength between the copper foil and the resin film measured in accordance with IPC-TM650-2.4.6.C is 0.5 kgf/cm or more and 4.0 kgf/cm or less.