Composition for provisional fixation and method for producing bonded structure
A temporary fixing composition is provided that is used to temporarily fix a first bonding target material and a second bonding target material to each other before the two bonding target materials are bonded to each other. The temporary fixing composition contains a first organic component having a viscosity of less than 70 mPa·s at 25° C. and a boiling point of 200° C. or lower and a second organic component having a viscosity of 70 mPa·s or greater at 25° C. and a boiling point of 210° C. or higher. It is preferable that, when thermogravimetry-differential thermal analysis is performed under the conditions at a temperature increase rate of 10° C./min in a nitrogen atmosphere with a sample mass of 30 mg, the 95% mass reduction temperature is lower than 300° C.
1. A temporary fixing composition comprising:
a first organic component having a viscosity of 40 mPa·s or less at 25° C. and a boiling point of 200° C. or lower; and
a second organic component having a viscosity of 70 mPa·s or greater at 25° C. and a boiling point of 210° C. or higher,
wherein the temporary fixing composition is used to temporarily fix a first bonding target material and a second bonding target material to each other before the first bonding target material and the second bonding target material are bonded to each other, and
the temporary fixing composition is substantially free of an organic polymer compound.
2. The temporary fixing composition according to claim 1 ,
wherein the first organic component does not change condition of the second bonding target material at 25° C.
3. The temporary fixing composition according to claim 1 ,
wherein at least one of the first bonding target material and the second bonding target material is a dried product of a paste containing metal microparticles, an organic solvent, and a regulator, and
when 1 g of the organic solvent, 1 g of a surface treating agent attached to the metal microparticles, or 1 g of the regulator and 9 g of the first organic component in the temporary fixing composition are mixed at 25° C., a liquid-liquid interface is observed therebetween, or a precipitate is observed in a mixed liquid.
4. The temporary fixing composition according to claim 1 , wherein a mass ratio of the first organic component to the second organic component is 1:99 to 70:30.
5. The temporary fixing composition according to claim 1 , wherein, when thermogravimetry-differential thermal analysis is performed under conditions at a temperature increase rate of 10° C./min in a nitrogen atmosphere with a sample mass of 30 mg, a 95% mass reduction temperature is lower than 300° C.
6. The temporary fixing composition according to claim 1 , wherein the first organic component is a liquid at 25° C.
7. The temporary fixing composition according to claim 1 , wherein the second organic component includes at least one selected from the group consisting of:
glycerin,
1,2,4-butanetriol,
4-(1′-acetoxy-1-methylethyl)-cyclohexanol acetate,
isobornyl cyclohexanol,
borneol,
2,4,6-triisopropyl-1,3,5-trioxane,
trimethylolpropane,
myristyl alcohol, and
2,4-diethyl-1,5-pentanediol.
8. The temporary fixing composition according to claim 1 , wherein the first organic component includes saturated hydrocarbons.
9. The temporary fixing composition according to claim 1 , wherein the first organic component includes decane.
10. A method for producing a bonded structure, the method comprising:
temporarily fixing a first bonding target material and a second bonding target material to each other with a temporary fixing composition disposed between the first bonding target material and the second bonding target material; and
firing the temporarily fixed bonding target materials to thereby bond the bonding target materials to each other,
wherein, the temporary fixing composition includes:
a first organic component having a viscosity of 40 mPa·s or less at 25° C. and a boiling point of 200° C. or lower; and
a second organic component having a viscosity of 70 mPa·s or greater at 25° C. and a boiling point of 210° C. or higher,
wherein the temporary fixing composition is substantially free of an organic polymer compound.
11. The method according to claim 10 , wherein at least one of the first bonding target material and the second bonding target material is constituted by a sintering precursor that is a dried product of a paste containing metal microparticles and an organic solvent.