Copper foil with carrier, copper foil with resin and method for manufacturing printed wiring board
There is provided a copper foil with a carrier particularly suitable for a circuit forming process for removing a carrier after laser drilling and desmear treatment, in detail, a copper foil with a carrier having high heat press resistance (heat resistance) of the carrier, laser drilling performance, corrosion resistance of the carrier against the desmear treatment, corrosion resistance of a release layer against the desmear treatment, and carrier release strength. The copper foil with a carrier comprises a carrier comprising at least one resin selected from polyethylene naphthalate (PEN) resins, polyethersulfone (PES) resins, polyimide resins, and polyphenylene sulfide resins; a silicon layer provided on the carrier, the silicon layer mainly containing silicon; a carbon layer provided on the silicon layer, the carbon layer mainly containing carbon; and an extremely thin copper layer provided on the carbon layer.
1. A copper foil comprising:
a carrier comprising at least one resin selected from polyethylene naphthalate resins, polyethersulfone resins, polyimide resins, and polyphenylene sulfide resins;
a silicon layer provided on the carrier;
a carbon layer provided on the silicon layer; and
a copper layer provided on the carbon layer, the copper layer having an arithmetic average roughness Ra of 1.0 to 50 nm measured according to JIS B 0601-2001.
2. The copper foil according to claim 1 , wherein the silicon layer has a silicon content of 60 atom % or more.
3. The copper foil according to claim 1 , wherein the silicon layer has a thickness of 1 to 50 nm.
4. The copper foil according to claim 1 , wherein the carbon layer has a thickness of 0.1 to 10 nm.
5. The copper foil according to claim 1 , wherein the copper layer has a thickness of 50 to 2500 nm.
6. A resin-coated copper foil comprising:
the copper foil according to claim 1 , and
a resin composition layer provided on the copper layer of the copper foil.
7. The copper foil according to claim 1 , further comprising a silicon-based adhesion layer on the copper layer, the silicon-based adhesion layer including 60 to 98 atom % silicon, 1.0 to 35.0 atom % carbon, and 1.0 to 40.0 atom % oxygen.
8. A method for manufacturing a printed circuit board comprising:
laminating a resin layer and the copper foil in sequence on at least one side of a core layer to form a laminate, the copper foil including:
a carrier comprising at least one resin selected from polyethylene naphthalate resins, polyethersulfone resins, polyimide resins, and polyphenylene sulfide resins;
a silicon layer provided on the carrier;
a carbon layer provided on the silicon layer; and
a copper layer provided on the carbon layer, the copper layer having an arithmetic average roughness Ra of 1.0 to 50 nm measured according to JIS B 0601-2001;
forming a via hole by laser drilling of the laminate,
desmear treating the laminate for removing smears from the via hole, and
removing the carrier after the desmear treating.
9. The method according to claim 8 , further comprising performing an electroless copper plating between the desmear treating and the carrier removing or after the carrier removing.
10. A method for manufacturing a printed circuit board comprising:
laminating a copper foil on at least one side of a core layer to form a laminate, and a resin composition layer provided on a copper layer of the copper foil, the copper foil including:
a carrier comprising at least one resin selected from polyethylene naphthalate resins, polyethersulfone resins, polyimide resins, and polyphenylene sulfide resins;
a silicon layer provided on the carrier;
a carbon layer provided on the silicon layer; and
the copper layer provided on the carbon layer and having an arithmetic average roughness Ra of 1.0 to 50 nm measured according to JIS B 0601-2001;
forming a via hole by laser drilling of the laminate,
desmear treating the laminate for removing smears from the via hole, and
removing the carrier after the desmear treating.
11. The method according to claim 10 , further comprising performing an electroless copper plating between the desmear treating and the carrier removing or after the carrier removing.