Electrolytic copper foil
Provided is an electrodeposited copper foil having high smoothness and at the same time exhibiting high flexibility (particularly, high flexibility after annealing at 180° C. for 1 hour) suitable for a flexible substrate. This electrodeposited copper foil has a ten-point average roughness Rz of 0.1 μm or larger and 2.0 μm or smaller on at least one surface, has a tensile strength measured in accordance with IPC-TM-650 of 56 kgf/mm 2 or more and less than 65 kgf/mm 2 in an unannealed original state, and has a tensile strength measured in accordance with IPC-TM-650 of 15 kgf/mm 2 or more and less than 25 kgf/mm 2 after annealing at 180° C. for 1 hour.
1. An electrodeposited copper foil having a ten-point average roughness Rz of 0.1 μm or larger and 2.0 μm or smaller on at least one surface,
wherein in an unannealed original state, the electrodeposited copper foil has a tensile strength measured in accordance with IPC-TM-650 of 56 kgf/mm 2 or more and less than 65 kgf/mm 2 , and
wherein after annealing at 180° C. for 1 hour, the electrodeposited copper foil has a tensile strength measured in accordance with IPC-TM-650 of 15 kgf/mm 2 or more and less than 25 kgf/mm 2 .
2. The electrodeposited copper foil according to claim 1 , wherein the electrodeposited copper foil has a ten-point average roughness Rz of 0.1 μm or larger and 2.0 μm or smaller on both surfaces.
3. The electrodeposited copper foil according to claim 1 ,
wherein in cross-sectional analysis by electron backscatter diffraction (EBSD), a proportion of an area occupied by copper crystal grains satisfying all of the following conditions:
i) (101) orientation;
ii) an aspect ratio of 0.500 or less;
iii) |sin θ| of 0.001 or more and 0.707 or less, where θ (°) is an angle between a normal to an electrode surface of the electrodeposited copper foil and a major axis of the copper crystal grain; and
iv) when the crystal is elliptically approximated, a length of a minor axis of 0.38 μm or smaller,
to an area of an observation field occupied by copper crystal grains is 63% or more.
4. A flexible substrate, comprising the electrodeposited copper foil according to claim 1 .