Electro-deposited copper foil, surface-treated copper foil using the electro-deposited copper foil and copper clad laminate using the surface-treated copper foil, and a method for manufacturing the electro-deposited copper foil
Present invention provides an electro-deposited copper foil having the equivalent low-profile surface as in a conventional low-profile electro-deposited copper foil and extremely large mechanical strength and a method for manufacturing the same. The electro-deposited copper foil is formed by depositing fine copper crystal grains having a small deviation of grain-diameter. The electro-deposited copper foil has a low-profile and glossy surface and has extremely large mechanical strength expressed by a tensile strength as received of 70 kgf/mm 2 to 100 kgf/mm 2 and has a tensile strength after heating (180° C. for 60 minutes) corresponding to 85% or more of the tensile strength as received. The electro-deposited copper foil is manufactured by electrolysis using a sulfuric acid base copper electrolytic solution containing a compound composed of a benzene ring having a sulfo group bonded thereto, a sulfonate of an active sulfur compound and a polymer of a quaternary ammonium salt having a cyclic structure.
1. An electro-deposited copper foil obtained by electrolysis of a copper electrolytic solution, wherein a tensile strength as received (hereinafter referred to as a “tensile strength as received”) is 88.4 kgf/mm 2 to 100 kgf/mm 2 ,
wherein a tensile strength after heating at 180° C. for 60 minutes (hereinafter referred to as a “tensile strength after heating”) is 85% or more of the tensile strength as received.
2. The electro-deposited copper foil according to claim 1 , wherein a tensile strength as received measured at 30 days after manufacturing is not less than 65 kgf/mm 2 .
3. The electro-deposited copper foil according to claim 1 , wherein an elongation as received (hereinafter referred to as an “elongation as received”) is 3% to 15%.
4. The electro-deposited copper foil according to claim 1 , wherein an elongation after heating at 180° C. for 60 minutes (hereinafter referred to as an “elongation after heating”) is not more than the elongation as received.
5. The electro-deposited copper foil according to claim 1 , wherein a gloss which is measured at a reflection angle of 60° for the transverse direction of a deposit surface (hereinafter referred to as “[Gs(60°)]”), is 80 or more.
6. A surface-treated electro-deposited copper foil characterized in that one, two or more types of treatments selected from a roughening treatment, a rust-proofing treatment and a silane coupling agent treatment are applied to a surface of the electro-deposited copper foil according to claim 1 .
7. A method for manufacturing the electro-deposited copper foil according to claim 1 by electrolysis using a sulfuric acid base copper electrolytic solution, characterized in that the sulfuric acid base copper electrolytic solution contains the following additives A to C:
Additive A: a compound composed of a benzene ring and a heterocyclic ring which contains a nitrogen atom (N) and a bonded mercapto-functional group, or a thiourea-functional compound;
Additive B: a sulfonate of an active sulfur compound;
Additive C: a polymer of a quaternary ammonium salt having a cyclic structure.
8. The method for manufacturing an electro-deposited copper foil according to claim 7 , wherein the additive A is one, two or more types of compounds selected from an imidazole-functional compound, a thiazole-functional compound, a tetrazole-functional compound and a thiourea-functional compound with an alkane group having 2 or more carbon atoms bonded at both ends.
9. The method for manufacturing an electro-deposited copper foil according to claim 7 , wherein the additive A has a benzene ring having a sulfo group bonded thereto.
10. The method for manufacturing an electro-deposited copper foil according to claim 7 , wherein the additive A is one, two or more types of compounds selected from 2-mercapto-5-benzimidazole sulfonic acid, 3(5-mercapto-1H-tetrazolyl)benzene sulfonate, 2-mercaptobenzothiazole or N—N diethylthiourea.
11. The method for manufacturing an electro-deposited copper foil according to claim 7 , wherein the total concentration of the additive A in the sulfuric acid base copper electrolytic solution is 1 ppm to 50 ppm.
12. The method for manufacturing an electro-deposited copper foil according to claim 7 , wherein the additive B is 3-mercapto-1-propanesulfonic acid, bis(3-sulfopropyl)disulfide or a mixture thereof.
13. The method for manufacturing an electro-deposited copper foil according to claim 7 , wherein the concentration of the additive B in the sulfuric acid base copper electrolytic solution is 1 ppm to 80 ppm.
14. The method for manufacturing an electro-deposited copper foil according to claim 7 , wherein the additive C is a diallyldimethylammonium chloride polymer.
15. The method for manufacturing an electro-deposited copper foil according to claim 7 , wherein the concentration of the additive C in the sulfuric acid base copper electrolytic solution is 0.5 ppm to 100 ppm.
16. The method for manufacturing an electro-deposited copper foil according to claim 7 , wherein the ratio of the concentration of the additive B to the concentration of the additive C in the sulfuric acid base copper electrolytic solution, that is, a value of [(B concentration)/(C concentration)], is 0.07 to 1.4.
17. The method for manufacturing an electro-deposited copper foil according to claim 6 , wherein the concentration of chlorine in the sulfuric acid base copper electrolytic solution is 5 ppm to 100 ppm.
18. A copper clad laminate obtained by bonding the surface-treated electro-deposited copper foil according to claim 6 to an insulating layer-forming material.
19. A rigid copper clad laminate according to claim 18 , wherein the insulating layer-forming material contains a reinforcement.
20. A rigid printed wiring board comprising the copper clad laminate according to claim 19 .
21. A copper clad laminate according to claim 18 , wherein the insulating layer-forming material is formed of a flexible material having flexibility.
22. A flexible printed wiring board comprising the copper clad laminate according to claim 21 .
23. An electro-deposited copper foil obtained by electrolysis of a copper electrolytic solution, wherein a tensile strength as received (hereinafter referred to as a “tensile strength as received”) is 70 kgf/mm 2 to 100 kgf/mm 2 ,
wherein a tensile strength after heating at 180° C. for 60 minutes (hereinafter referred to as a “tensile strength after heating”) is 85% or more of the tensile strength as received, and
wherein the copper foil has a surface roughness (Rzjis) at a deposit surface of 0.88 micron-meter or less.
24. A surface-treated electro-deposited copper foil characterized in that one, two or more types of treatments selected from a roughening treatment, a rust-proofing treatment and a silane coupling agent treatment are applied to a surface of the electro-deposited copper foil according to claim 23 .
25. A copper clad laminate obtained by bonding the surface-treated electro-deposited copper foil according to claim 24 to an insulating layer-forming material.
26. A copper clad laminate according to claim 25 , wherein the insulating layer-forming material contains a reinforcement.
27. A rigid printed wiring board comprising the copper clad laminate according to claim 26 .
28. A copper clad laminate according to claim 25 , wherein the insulating layer-forming material is formed of a flexible material having flexibility.
29. A flexible printed wiring board comprising the copper clad laminate according to claim 28 .