Copper particles and method for producing same
Copper particles are provided that each include a core particle made of copper and a coating layer that coats the surface of the core particle, wherein the coating layer is made of a copper salt of an aliphatic organic acid. It is also preferable that the copper particles have an infrared absorption peak in a range of 1504 to 1514 cm −1 and no infrared absorption peak in a range of 1584 to 1596 cm −1 . It is also preferable that, in thermogravimetric analysis of the copper particles, the temperature at which the ratio of the mass loss value to the mass loss value at 500° C. reaches 10% is from 150° C. to 220° C. A method is also provided for producing copper particles, the method including bringing core particles made of copper into contact with a solution containing a copper salt of an aliphatic organic acid to thereby coat the surface of the core particles.
1. Copper particles each comprising a core particle made of copper and a coating layer that coats a surface of the core particle,
wherein the coating layer comprises a surface treatment agent containing a copper salt of an aliphatic organic acid,
an average particle size of primary particles of the copper particles is in a range of 0.05 μm to 1.0 μm, and
the copper particles have an infrared absorption peak in a range of 1504 to 1514 cm −1 and no infrared absorption peak in a range of 1584 to 1596 cm −1 .
2. The copper particles according to claim 1 ,
wherein the coating layer is made of a copper salt of an aliphatic organic acid.
3. The copper particles according to claim 1 ,
wherein, in thermogravimetric analysis, a temperature at which a ratio of a mass loss value to the mass loss value at 500° C. reaches 10% is from 150° C. to 220° C.
4. The copper particles according to claim 1 ,
wherein the aliphatic organic acid has 6 to 18 carbon atoms.
5. The copper particles according to claim 1 ,
wherein an amount of the surface treatment agent, which is coated on the surface of the core particle, is in a range of 0.2 mass % to 2.0 mass %, and
the amount is expressed as a ratio (mass %) of an entirety of the surface treatment agent, which is coated on the surface of the core particle, to the copper particles to which the surface treatment agent is applied.
6. The copper particles according to claim 1 ,
wherein the copper particles have a circularity coefficient of 0.85 or greater.
7. The copper particles according to claim 1 ,
wherein the copper salt of the aliphatic organic acid is copper laurate, copper caprylate, or copper oleate.
8. A method for producing copper particles according to claim 1 , comprising bringing core particles made of copper into contact with a solution containing a copper salt of an aliphatic organic acid to thereby coat a surface of the core particles.
9. The method according to claim 8 ,
wherein the solution includes a surface treatment agent containing the copper salt of the aliphatic organic acid,
an amount of the surface treatment agent, which is coated on the surface of the core particle, is in a range of 0.2 mass % to 2.0 mass %, and
the amount is expressed as a ratio (mass %) of an entirety of the surface treatment agent, which is coated on the surface of the core particle, to the copper particles to which the surface treatment agent is applied.
10. The method according to claim 8 ,
wherein the copper particles have a circularity coefficient of 0.85 or greater.
11. The method according to claim 8 ,
wherein the copper salt of the aliphatic organic acid is copper laurate, copper caprylate, or copper oleate.
12. A method for producing a conductor film, comprising applying a conductive composition containing the copper particles according to claim 1 and an organic solvent to a substrate to form a coating film, and heating the coating film.