Bonding composition, conductor bonding structure, and method for producing same
A bonding composition contains copper powder, a liquid medium, and a reducing agent. The reducing agent contains at least one amino group and a plurality of hydroxyl groups. The reducing agent has a boiling point that is higher than the boiling point of the liquid medium. The reducing agent has a melting point that is equal to or below the sintering temperature of the copper powder. Preferably, the reducing agent is bis(2hydroxyethyl)iminotris(hydroxymethyl)methane. Preferably, the bonding composition has a viscosity of from 10 Pa·s to 200 Pa·s at a shear rate of 10 s −1 at 25° C. Preferably, the bonding composition contains from 0.1 parts to 10 parts by mass of the reducing agent and from 10 parts to 40 parts by mass of the liquid medium with respect to 100 parts by mass of the copper powder.
1. A bonding composition comprising copper powder, a liquid medium, and a reducing agent, wherein:
the reducing agent contains at least one amino group and a plurality of hydroxyl groups;
the reducing agent has a boiling point that is higher than a boiling point of the liquid medium;
the reducing agent has a melting point that is equal to or below the sintering temperature of the copper powder; and
the reducing agent is represented by formula (1) or (2) below:
wherein:
R 1 to R 5 each independently represent a hydrogen atom, a hydroxyl group, a saturated or unsaturated aliphatic group having 1 to 10 carbon atoms, or a saturated or unsaturated aliphatic group having 1 to 10 carbon atoms and containing a hydroxyl group; and at least two of R 1 to R 5 contain a hydroxyl group; and
R 6 to R 11 each independently represent a hydrogen atom, a hydroxyl group, a hydrocarbon group having 1 to 10 carbon atoms, or a hydrocarbon group having 1 to 10 carbon atoms and containing a hydroxyl group; R 12 represents a hydrocarbon group having 1 to 10 carbon atoms or a hydrocarbon group having 1 to 10 carbon atoms and containing a hydroxyl group; and at least two of R 6 to R 11 contain a hydroxyl group.
2. The bonding composition according to claim 1 , wherein the reducing agent is bis(2-hydroxyethyl)iminotris(hydroxymethyl)methane.
3. The bonding composition according to claim 1 , wherein the bonding composition has a viscosity of from 10 Pa·s to 200 Pa·s at a shear rate of 10 s −1 at 25° C.
4. The bonding composition according to claim 1 , comprising the copper powder, from 0.1 parts to 10 parts by mass of reducing agent with respect to 100 parts by mass of the copper powder, and from 10 parts to 40 parts by mass of the liquid medium with respect to 100 parts by mass of the copper powder.
5. A method for producing a conductor bonding structure, the method comprising:
applying the bonding composition according to claim 1 onto a surface of a first conductor to form a coating film;
drying the coating film to remove at least a portion of the liquid medium and thereby obtain a dried coating film;
applying a second conductor onto the dried coating film to interpose the dried coating film between the first conductor and the second conductor; and
heating the dried coating film, to sinter the copper powder contained in the dried coating film and thereby bond the first conductor and the second conductor.
6. The bonding composition according to claim 2 , wherein the bonding composition has a viscosity of from 10 Pas to 200 Pas at a shear rate of 10 s −1 at 25° C.
7. The bonding composition according to claim 2 , comprising the copper powder, from 0.1 parts to 10 parts by mass of reducing agent with respect to 100 parts by mass of the copper powder, and from 10 parts to 40 parts by mass of the liquid medium with respect to 100 parts by mass of the copper powder.
8. The bonding composition according to claim 3 , comprising the copper powder, from 0.1 parts to 10 parts by mass of reducing agent with respect to 100 parts by mass of the copper powder, and from 10 parts to 40 parts by mass of the liquid medium with respect to 100 parts by mass of the copper powder.
9. The bonding composition according to claim 6 , comprising the copper powder, from 0.1 parts to 10 parts by mass of reducing agent with respect to 100 parts by mass of the copper powder, and from 10 parts to 40 parts by mass of the liquid medium with respect to 100 parts by mass of the copper powder.
10. A method for producing a conductor bonding structure, the method comprising:
applying the bonding composition according to claim 1 onto a surface of a first conductor to form a coating film;
drying the coating film to remove at least a portion of the liquid medium and thereby obtain a dried coating film;
applying a second conductor onto the dried coating film to interpose the dried coating film between the first conductor and the second conductor; and
heating the dried coating film, to sinter the copper powder contained in the dried coating film and thereby bond the first conductor and the second conductor.
11. A method for producing a conductor bonding structure, the method comprising:
applying the bonding composition according to claim 2 onto a surface of a first conductor to form a coating film;
drying the coating film to remove at least a portion of the liquid medium and thereby obtain a dried coating film;
applying a second conductor onto the dried coating film to interpose the dried coating film between the first conductor and the second conductor; and
heating the dried coating film, to sinter the copper powder contained in the dried coating film and thereby bond the first conductor and the second conductor.
12. A method for producing a conductor bonding structure, the method comprising:
applying the bonding composition according to claim 3 onto a surface of a first conductor to form a coating film;
drying the coating film to remove at least a portion of the liquid medium and thereby obtain a dried coating film;
applying a second conductor onto the dried coating film to interpose the dried coating film between the first conductor and the second conductor; and
heating the dried coating film, to sinter the copper powder contained in the dried coating film and thereby bond the first conductor and the second conductor.
13. A method for producing a conductor bonding structure, the method comprising:
applying the bonding composition according to claim 4 onto a surface of a first conductor to form a coating film;
drying the coating film to remove at least a portion of the liquid medium and thereby obtain a dried coating film;
applying a second conductor onto the dried coating film to interpose the dried coating film between the first conductor and the second conductor; and
heating the dried coating film, to sinter the copper powder contained in the dried coating film and thereby bond the first conductor and the second conductor.
14. A method for producing a conductor bonding structure, the method comprising:
applying the bonding composition according to claim 6 onto a surface of a first conductor to form a coating film;
drying the coating film to remove at least a portion of the liquid medium and thereby obtain a dried coating film;
applying a second conductor onto the dried coating film to interpose the dried coating film between the first conductor and the second conductor; and
heating the dried coating film, to sinter the copper powder contained in the dried coating film and thereby bond the first conductor and the second conductor.