Metal foil with releasing resin layer, and printed wiring board
There is provided with a metal foil-releasable resin layer composite comprising a metal foil and a releasable resin layer on at least one surface of the metal foil, wherein the releasable resin layer includes 100 parts by mass, in total, of (A) 50 to 95 parts by mass of a nonpolar resin, (B) 4 to 40 parts by mass of a thermosetting resin, and (C) 1 to 25 parts by mass of a release agent, wherein the mass ratio (A/B) of the nonpolar resin (A) to the thermosetting resin (B) is 55/45 to 96/4. The metal foil-releasable resin layer composite can achieve release with significantly low release strength between the metal foil and the releasable resin layer without damage of the releasable resin layer and can withstand hot pressing.
1. A metal foil-releasable resin layer composite comprising a metal foil and a releasable resin layer on at least one surface of the metal foil, wherein the releasable resin layer comprises 100 parts by mass, in total, of
(A) 55 to 95 parts by mass of a nonpolar resin,
(B) 4 to 40 parts by mass of a thermosetting resin having a vinyl group, and
(C) 1 to 25 parts by mass of a release agent, wherein the release agent is at least one selected from the group consisting of fluorine surfactants, fluorine oil, silicone oil, and silicone emulsions,
wherein:
the nonpolar resin is a styrene thermoplastic elastomer;
the thermosetting resin having a vinyl group is a styrene-modified polyphenylene ether resin; and
the mass ratio (A/B) of the nonpolar resin (A) to the thermosetting resin (B) is 55/40 to 95/4.
2. The metal foil-releasable resin layer composite according to claim 1 , wherein a release strength of the metal foil from the releasable resin layer is 1 to 100 g/cm, determined in accordance with JIS C 6481 (1996).
3. The metal foil-releasable resin layer composite according to claim 1 , wherein the metal foil is mechanically releasable without damage of the releasable resin layer.
4. The metal foil-releasable resin layer composite according to claim 1 , wherein the releasable resin layer comprises 60 to 80 parts by mass of the nonpolar resin.
5. The metal foil-releasable resin layer composite according to claim 1 , wherein the releasable resin layer comprises 15 to 30 parts by mass of the thermosetting resin.
6. The metal foil-releasable resin layer composite according to claim 1 , wherein the mass ratio (AB) of the nonpolar resin (A) to the thermosetting resin (B) is 60/40 to 90/10.
7. The metal foil-releasable resin layer composite according to claim 1 , wherein the releasable resin layer further comprises an inorganic filler.
8. The metal foil-releasable resin layer composite according to claim 1 , wherein the releasable resin layer comprises no prepreg.
9. The metal foil-releasable resin layer composite according to claim 1 , wherein each of the two surfaces of the releasable resin layer contacts a metal foil.
10. The metal foil-releasable resin layer composite according to claim 1 , wherein the metal foil is a copper foil or a copper alloy foil.
11. The metal foil-releasable resin layer composite according to claim 1 , wherein the metal foil has a thickness of 7 to 210 μm and the releasable resin layer has a thickness of 1 to 100 μm.
12. The metal foil-releasable resin layer composite according to claim 1 , wherein the release agent is at least one selected from the group consisting of fluorine surfactants, fluorine oil, and silicone oil.
13. The metal foil-releasable resin layer composite according to claim 1 , wherein the release agent is at least one selected from the group consisting of fluorine surfactants and fluorine oil.
14. A method of making a printed wiring board component comprising separating at least one metal foil layer from at least one surface of the releasable resin layer of claim 1 .