Semiconductor device and method for manufacturing the same
Provided is a semiconductor device including: a gate electrode; a channel layer arranged in a region directly below or directly above the gate electrode; a source and a drain electrodes arranged to be in contact with the channel layer; and a first insulating layer arranged between the gate electrode and the channel layer, the channel layer including a first oxide semiconductor, the source electrode and/or the drain electrode including a second oxide semiconductor, the first and second oxide semiconductors containing In, W and Zn, a content rate of W/(In+W+Zn) being higher than 0.001 atomic % and not higher than 8.0 atomic %, a content rate of Zn/(In+W+Zn) being from 1.2 atomic % to 40 atomic %, an atomic ratio of Zn to W being higher than 1.0 and lower than 20000. Also provided is a method for manufacturing the device.
1. A semiconductor device comprising:
a gate electrode;
a channel layer arranged in a region directly below or directly above the gate electrode;
a source electrode and a drain electrode arranged to be in contact with the channel layer; and
a first insulating layer arranged between the gate electrode and the channel layer,
the channel layer including a first oxide semiconductor, and at least one of the source electrode and the drain electrode including a second oxide semiconductor,
the first oxide semiconductor and the second oxide semiconductor containing indium, tungsten and zinc,
a content rate of tungsten to a total of indium, tungsten and zinc in the first oxide semiconductor and the second oxide semiconductor being higher than 0.001 atomic % and not higher than 8.0 atomic %,
a content rate of zinc to the total of indium, tungsten and zinc in the first oxide semiconductor and the second oxide semiconductor being not lower than 1.2 atomic % and not higher than 40 atomic %,
an atomic ratio of zinc to tungsten in the first oxide semiconductor and the second oxide semiconductor being higher than 1.0 and lower than 20000, wherein
the first oxide semiconductor contains hexavalent tungsten.
2. The semiconductor device according to claim 1 , wherein
content rates of indium, tungsten and zinc in the first oxide semiconductor are the same as content rates of indium, tungsten and zinc in the second oxide semiconductor, respectively.
3. The semiconductor device according to claim 1 , wherein
an electric resistivity of the channel layer is not lower than 10 −1 Ωcm, and
an electric resistivity of the source electrode and the drain electrode is not higher than 10 −2 Ωcm.
4. The semiconductor device according to claim 1 , wherein
the first oxide semiconductor and the second oxide semiconductor are composed of nanocrystalline oxide or amorphous oxide.
5. The semiconductor device according to claim 1 , wherein
the channel layer further contains zirconium, and
a content of the zirconium is not smaller than 1×10 17 atms/cm 3 and not larger than 1×10 20 atms/cm 3 .
6. A method for manufacturing the semiconductor device as recited in claim 1 , comprising:
forming the gate electrode;
forming a layer including an oxide semiconductor;
forming a partially covering insulating layer covering a part of a main surface of the layer including the oxide semiconductor; and
performing heat treatment after forming the partially covering insulating layer.
7. The manufacturing method according to claim 6 , further comprising
forming a low oxygen insulating layer covering a region adjacent to the part of the main surface of the layer including the oxide semiconductor, after forming the layer including the oxide semiconductor and before performing the heat treatment, wherein
the low oxygen insulating layer is lower in oxygen atom content rate than the partially covering insulating layer.
8. The manufacturing method according to claim 6 , wherein
the partially covering insulating layer is the first insulating layer or a second insulating layer different from the first insulating layer.
9. The manufacturing method according to claim 6 , wherein
in forming the partially covering insulating layer, the partially covering insulating layer is patterned by self alignment with the gate electrode.
10. The manufacturing method according to claim 6 , wherein
performing the heat treatment includes performing heat treatment at a temperature of not lower than 100° C. and not higher than 500° C.
11. A semiconductor device comprising:
a gate electrode;
a channel layer arranged in a region directly below or directly above the gate electrode;
a source electrode and a drain electrode arranged to be in contact with the channel layer; and
a first insulating layer arranged between the gate electrode and the channel layer,
the channel layer including a first oxide semiconductor, and at least one of the source electrode and the drain electrode including a second oxide semiconductor,
the first oxide semiconductor and the second oxide semiconductor containing indium, tungsten and zinc,
a content rate of tungsten to a total of indium, tungsten and zinc in the first oxide semiconductor and the second oxide semiconductor being higher than 0.001 atomic % and not higher than 8.0 atomic %,
a content rate of zinc to the total of indium, tungsten and zinc in the first oxide semiconductor and the second oxide semiconductor being not lower than 1.2 atomic % and not higher than 40 atomic %,
an atomic ratio of zinc to tungsten in the first oxide semiconductor and the second oxide semiconductor being higher than 1.0 and lower than 20000, wherein
the first insulating layer is a layer covering a main surface of the channel layer and not covering main surfaces of the source electrode and the drain electrode, and
the semiconductor device further comprises a low oxygen insulating layer that is an insulating layer covering the main surfaces of the source electrode and the drain electrode and is lower in oxygen atom content rate than the first insulating layer.
12. The semiconductor device according to claim 11 , wherein
content rates of indium, tungsten and zinc in the first oxide semiconductor are the same as content rates of indium, tungsten and zinc in the second oxide semiconductor, respectively.
13. The semiconductor device according to claim 11 , wherein
an electric resistivity of the channel layer is not lower than 10 −1 Ωcm, and
an electric resistivity of the source electrode and the drain electrode is not higher than 10 −2 Ωcm.
14. The semiconductor device according to claim 11 , wherein
the first oxide semiconductor and the second oxide semiconductor are composed of nanocrystalline oxide or amorphous oxide.
15. The semiconductor device according to claim 11 , wherein
the channel layer further contains zirconium, and
a content of the zirconium is not smaller than 1×10 17 atms/cm 3 and not larger than 1×10 20 atms/cm 3 .
16. A semiconductor device comprising:
a gate electrode;
a channel layer arranged in a region directly below or directly above the gate electrode;
a source electrode and a drain electrode arranged to be in contact with the channel layer; and
a first insulating layer arranged between the gate electrode and the channel layer,
the channel layer including a first oxide semiconductor, and at least one of the source electrode and the drain electrode including a second oxide semiconductor,
the first oxide semiconductor and the second oxide semiconductor containing indium, tungsten and zinc,
a content rate of tungsten to a total of indium, tungsten and zinc in the first oxide semiconductor and the second oxide semiconductor being higher than 0.001 atomic % and not higher than 8.0 atomic %,
a content rate of zinc to the total of indium, tungsten and zinc in the first oxide semiconductor and the second oxide semiconductor being not lower than 1.2 atomic % and not higher than 40 atomic %,
an atomic ratio of zinc to tungsten in the first oxide semiconductor and the second oxide semiconductor being higher than 1.0 and lower than 20000, wherein
the semiconductor device further comprises:
a second insulating layer covering a main surface of the channel layer and not covering main surfaces of the source electrode and the drain electrode; and
a low oxygen insulating layer that is an insulating layer covering the main surfaces of the source electrode and the drain electrode and is lower in oxygen atom content rate than the second insulating layer.
17. The semiconductor device according to claim 16 , wherein
content rates of indium, tungsten and zinc in the first oxide semiconductor are the same as content rates of indium, tungsten and zinc in the second oxide semiconductor, respectively.
18. The semiconductor device according to claim 16 , wherein
an electric resistivity of the channel layer is not lower than 10 −1 Ωcm, and
an electric resistivity of the source electrode and the drain electrode is not higher than 10 −2 Ωcm.
19. The semiconductor device according to claim 16 , wherein
the first oxide semiconductor and the second oxide semiconductor are composed of nanocrystalline oxide or amorphous oxide.
20. The semiconductor device according to claim 16 , wherein
the channel layer further contains zirconium, and
a content of the zirconium is not smaller than 1×10 17 atms/cm 3 and not larger than 1×10 20 atms/cm 3 .