Patent Assignment
Reel/Frame 021723/0329
Assignment of Assignor's Interest
Recorded: 2008-10-22
Pages: 4
Assignors
KUO, JER-HAUR
Executed: 2008-09-10
ZHA, XIN-XIANG
Executed: 2008-09-10
YU, YE-FEI
Executed: 2008-09-10
YANG, LIN
Executed: 2008-09-10
YU, FANG-XIANG
Executed: 2008-09-10
Assignees
FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
NO. 2, 2ND DONGHUAN ROAD,LONGHUA TOWN, BAO' AN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE, CHINA
FOXCONN TECHNOLOGY CO., LTD.
3-2,CHUNG SHAN ROAD, TU-CHENG,TAIPEI HSIEN, TAIWAN
Covered Property
(1)
Securing Device for Assembling Heat Dissipation Module Onto Electronic Component