Patent Assignment
Reel/Frame 021729/0540
Assignment of Assignor's Interest
Recorded: 2008-10-24
Pages: 3
Assignor
YOSHIKAWA, KAZUHIRO
Executed: 2008-09-12
Assignee
IBIDEN CO., LTD.
2-1, KANDA-CHO, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Wiring Substrate and Method of Manufacturing the Same