IP Library › Assignment 021733/0097
Patent Assignment
Reel/Frame 021733/0097

Assignment of Assignor's Interest

Recorded: 2008-10-24 Pages: 5
Assignors
JING, TAO
Executed: 2008-10-14
DAI, MAIDONG
Executed: 2008-10-14
Assignee
INTEGRATED DEVICE TECHNOLOGY, INC.
6024 SILVER CREEK VALLEY ROAD, SAN JOSE, CALIFORNIA, 95138
Covered Property (1)
Esd Protection Circuit for Inside a Power Pad or Input/Output Pad
Patent: 7,903,380 →
Application: 12/256,643 →
Publication: US 2009/0109583
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
Release of Security Interest Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION
Reel/Frame 048746/0001 →