IP Library Assignment 021740/0317
Patent Assignment
Reel/Frame 021740/0317

Assignment of Assignor's Interest

Recorded: 2008-10-27 Pages: 3
Assignors
LI, MING
Executed: 2008-10-21
DING, YING
Executed: 2008-10-21
TU, PING LIANG
Executed: 2008-10-21
LO, KING MING
Executed: 2008-10-21
CHUNG, KWOK KEE
Executed: 2008-10-21
Assignee
ASM ASSEMBLY AUTOMATION LTD
20/F., WATSON CENTRE, 16-22 KUNG YIP ST., KWAI CHUNG, HONG KONG
Covered Property (1)
Direct Die Attach Utilizing Heated Bond Head
Patent: 7,854,365 →
Application: 12/258,675 →
Publication: US 2010/0105172
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Dec 1, 2023
From: ASM ASSEMBLY AUTOMATION LTD
To: ASM TECHNOLOGY SINGAPORE PTE LTD
Reel/Frame 065734/0173 →
Change of Name Dec 1, 2023
From: ASM TECHNOLOGY SINGAPORE PTE LTD
To: ASMPT SINGAPORE PTE. LTD.
Reel/Frame 065745/0535 →