Patent Assignment
Reel/Frame 021755/0207
Assignment of Assignor's Interest
Recorded: 2008-10-29
Pages: 3
Assignors
CHANG CHIEN, PAO-HUEI
Executed: 2008-10-13
HU, PING-CHENG
Executed: 2008-10-01
CHEN, CHIEN-WEN
Executed: 2008-10-21
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOSIUNG, TAIWAN
Covered Property
(1)
Advanced Quad Flat No Lead Chip Package Having Marking and Corner Lead Features and Manufacturing Methods Thereof