Patent Assignment
Reel/Frame 021761/0183
Assignment of Assignor's Interest
Recorded: 2008-10-30
Pages: 3
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Stacked Semiconductor Package and Method for Fabricating the Same