Patent Assignment
Reel/Frame 021770/0129
Assignment of Assignor's Interest
Recorded: 2008-10-17
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Hierarchical Based 3D Image Processor, Method, and Medium