IP Library › Assignment 021770/0149
Patent Assignment
Reel/Frame 021770/0149

Assignment of Assignor's Interest

Recorded: 2008-10-31 Received: 2008-10-31 Pages: 2
Assignors
PALMER, BENTLEY J.
Executed: 2008-10-23
SAWAYDA, REBECCA A.
Executed: 2008-10-23
Assignee
DUPONT AIR PRODUCTS NANOMATERIALS LLC
7201 HAMILTON BLVD., ALLENTOWN, PA, 18195-1501, UNITED STATES
Covered Property (1)
Method for Forming Through-base Wafer Vias in Fabrication of Stacked Devices
Application: 12/242,002 →