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App. No. 12/242,002 · Confirmation No. 8035

Method for Forming Through-base Wafer Vias in Fabrication of Stacked Devices

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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2010-12-22 ABN Abandonment 2 View
2010-04-27 CTNF Non-Final Rejection 2 View
2010-04-27 CTNF Non-Final Rejection 16 View
2010-04-27 892 List of references cited by examiner 1 View
2010-04-27 FWCLM Index of Claims 1 View
2010-04-27 SRFW Search information including classification, databases and other search related notes 1 View
2010-04-27 1449 List of References cited by applicant and considered by examiner 5 View
2010-04-27 SRNT Examiner's search strategy and results 61 View
2010-04-01 NTC.PUB Notice of Publication 1 View
2009-12-30 SRNT Examiner's search strategy and results 1 View
2008-11-14 APP.FILE.REC Filing Receipt 3 View
2008-11-14 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2008-10-31 PEFR Applicant Response to Pre-Exam Formalities Notice 2 View
2008-10-31 OATH Oath or Declaration filed 4 View
2008-10-31 PA.. Power of Attorney 1 View
2008-10-31 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
2008-10-31 WFEE Fee Worksheet (SB06) 2 View
2008-10-31 N417 Electronic Filing System Acknowledgment Receipt 3 View
2008-10-15 NTC.MISS.PRT Notice to File Missing Parts 2 View
2008-10-15 APP.FILE.REC Filing Receipt 3 View
2008-09-30 IDS Information Disclosure Statement (IDS) Form (SB08) 5 View
2008-09-30 TRAN.LET Transmittal Letter 2 View
2008-09-30 WFEE Fee Worksheet (SB06) 2 View
2008-09-30 N417 Electronic Filing System Acknowledgment Receipt 4 View
2008-09-30 ADS Application Data Sheet 4 View
2008-09-30 SPEC Specification 34 View
2008-09-30 CLM Claims 4 View
2008-09-30 ABST Abstract 1 View
2008-09-30 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
12/242,002
Filed
2008-09-30
Pub. No.
US20100081279A1
Art Unit
2812