Patent Assignment
Reel/Frame 021772/0214
Assignment of Assignor's Interest
Recorded: 2008-11-01
Pages: 3
Assignor
SHIM, SANG CHUL
Executed: 2008-10-23
Assignee
DONGBU HITEK CO., LTD.
891-10 DAECHI-DONG, KANGNAM-KU, SEOUL, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property
(1)
Method for Forming Metal Line of Semiconductor Device