Assignment of Assignor's Interest

Recorded: 2008-11-03 Pages: 4

Assignor

HASHIMOTO, KEIJI

Executed: 2008-09-16

Assignee

RENESAS TECHNOLOGY CORP.

6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN

Covered Property (1)

Semiconductor Device with at Least One Air Gap Provided in Chip Outer Area

Application: 12/263,859 →

Publication: US 2009/0121313

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.