Patent Assignment
Reel/Frame 025008/0390
Change of Name
Recorded: 2010-09-09
Pages: 50
Assignor
RENESAS TECHNOLOGY CORP.
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI,, KANAGAWA, 211-8668, JAPAN
Covered Properties
(82)
Internal Power-Source Potential Supply Circuit, Step-Up Potential Generating System, Output Potential Supply Circuit, and Semiconductor Memory
Patent:
6,831,502 →
Application:
08/755,928 →
Semiconductor Device Manufacturing Method
Semiconductor Device, Method of Manufacturing Semiconductor Device and Communication Method
Semiconductor Device Having Impurity Region Under Isolation Region
Inductance Measuring Method
Semiconductor Device
Semiconductor Memory Device
Method of Manufacturing Semiconductor Device Having Impurity Region Under Isolation Region
Semiconductor Device Manufacturing Method
Btl Amplifier Capable of Providing Stability of Offset Compensation
Integrated Circuit with Associated Memory Function
Polarizer, Projection Lens System, Exposure Apparatus and Exposing Method
Semiconductor Device
Semiconductor Memory Device with Bit Line of Small Resistance and Manufacturing Method Thereof
Disconnection and Short Detecting Circuit That Can Detect Disconnection and Short of a Signal Line Transmitting a Differential Clock Signal
Semiconductor Memory Device and Method of Manufacturing the Same
Ad Conversion Method
Squelch Detecting Circuit
Automatic Placement and Routing Apparatus and Automatic Placement and Routing Method
Semiconductor Memory Device and Driving Method Thereof
Semiconductor Memory Device with a Page Mode
Nonvolatile Semiconductor Memory Device and Method of Rewriting Data Thereof
Semiconductor Device
Delay Calculation Method Capable of Calculating Delay Time with Small Margin of Error
Current Source Circuit and Differential Amplifier
Semiconductor Device
Semiconductor Device Having an Soi Structure, Manufacturing Method Thereof, and Memory Circuit
Magnetic Memory Device
Can System
Semiconductor Storage Device
Oscillator and Charge Pump Circuit Using the Same
Semiconductor Device Provided with Feedback Circuit Including Resistive Element and Capacitive Element
Semiconductor Device and Method of Manufacturing the Same
High-Frequency Semiconductor Device and Method of Manufacturing the Same
Method of Manufacturing Semiconductor Device Having Impurity Region Under Isolation Region
Magnetic Memory Device
Semiconductor Device
Nonvolatile Semiconductor Memory Device and Method of Rewriting Data Thereof
Nonvolatile Semiconductor Memory Device and Method of Rewriting Data Thereof
Disconnection and Short Detecting Circuit That Can Detect Disconnection and Short of a Signal Line Transmitting a Differential Clock Signal
Semiconductor Device Having Elastic Solder Bump to Prevent Disconnection
Semiconductor Memory Device with Bit Line of Small Resistance and Manufacturing Method Thereof
Manufacturing Method of Semiconductor Device
Semiconductor Device
Semiconductor Memory Device and Method of Manufacturing the Same
Semiconductor Memory Device
Current Source Circuit and Differential Amplifier
Method of Manufacturing Semiconductor Device Having Impurity Region Under Isolation Region
Method of Manufacturing Semiconductor Device Having Impurity Region Under Isolation Region
Manufacturing method of semiconductor device and semiconductor device
Application:
11/907,998 →
Publication:
US 2008/0093709
Semiconductor Device and Its Manufacturing Method, Semiconductor Manufacturing Mask, and Optical Proximity Processing Method
Manufacturing Method for Semiconductor Device
Multiprocessor System
A Semiconductor Device Which Transmits or Receives a Signal to or from an External Memory by a Ddr System
Can System
Semiconductor Device
Request Arbitration Device and Memory Controller
Differential Amplifier Circuit and a/D Converter
Oscillator and Charge Pump Circuit Using the Same
Method for Calculating Difficulty Level of Routing in Netlist
Application:
12/169,481 →
Publication:
US 2009/0019404
Semiconductor Device
A/D Converter and Semiconductor Device
Semiconductor Wafer and Manufacturing Method for Semiconductor Device
Motor Driving Device
Filter Circuit and Communication Semiconductor Device Using the Same
Parallel Data Output Control Circuit and Semiconductor Device
Magnetic Memory Device
Delay Calculation Method Capable of Calculating Delay Time with Small Margin of Error
Application:
12/250,695 →
Publication:
US 2009/0043558
Semiconductor Device and Method for Manufacturing the Same
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device with at Least One Air Gap Provided in Chip Outer Area
Application:
12/263,859 →
Publication:
US 2009/0121313
Semiconductor Device
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device and Method for Controlling Semiconductor Device
Semiconductor Memory Device
Semiconductor Device
Magnetic Memory Device
Application:
12/476,536 →
Publication:
US 2009/0237989
Microcomputer System
Semiconductor Integrated Circuit Device
Semiconductor Device
Parallel Data Output Control Circuit and Semiconductor Device
Semiconductor Device and Method of Manufacturing the Same
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 25, 1996
From: OOISHI, TSUKASA
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 008318/0985 →
Assignment of Assignor's Interest
Nov 17, 1999
From: KUNIKIYO, TATSUYA
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 010405/0515 →
Assignment of Assignor's Interest
Apr 20, 2000
From: MAEDA, SHIGENOBU; IPPOSHI, TAKASHI; KURIYAMA, HIROTADA; HONDA, HIROKI
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 010754/0648 →
Assignment of Assignor's Interest
Nov 20, 2001
From: MAEDA, SHIGENOBU; IWAMATSU, TOSHIAKI; IPPOSHI, TAKASHI
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 012316/0460 →
Assignment of Assignor's Interest
Mar 26, 2003
From: KUNIKIYO, TATSUYA
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 013914/0628 →
Assignment of Assignor's Interest
Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Assignment of Assignor's Interest
Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →
Assignment of Assignor's Interest
May 27, 2004
From: IIZUKA, KOJI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015401/0342 →
Assignment of Assignor's Interest
Jun 21, 2004
From: MIYAZAKI, KATSUMI
To: RENESAS TECHNOLOGY CORP.; RENESAS DIVICE DESIGN CORP.
Reel/Frame 015498/0819 →
Assignment of Assignor's Interest
Jul 12, 2004
From: IPPOSHI, TAKASHI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015567/0756 →
Assignment of Assignor's Interest
Jul 22, 2004
From: SHIMIZU, SATOSHI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015626/0400 →
Assignment of Assignor's Interest
Jul 28, 2004
From: ISHIBASHI, ATSUHIKO; FUJINO, YASUHIRO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015631/0365 →
Assignment of Assignor's Interest
Sep 8, 2004
From: INOUE, HIDEO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015781/0780 →
Assignment of Assignor's Interest
Sep 28, 2004
From: INOUE, KAZUNARI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015833/0468 →
Assignment of Assignor's Interest
Nov 8, 2004
From: YAMADA, TETSUYA; UENO, RITSUKO; OKAGAWA, TAKASHI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015967/0681 →
Assignment of Assignor's Interest
Dec 17, 2004
From: HIRANO, YUUICHI; IPPOSHI, TAKASHI; MAEGAWA, SHIGETO; NII, KOJI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 016101/0276 →
Assignment of Assignor's Interest
Aug 22, 2006
From: KANZAKI, TERUAKI; DEGUCHI, YOSHINORI; MIKI, KAZUNOBU
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 018244/0189 →
Change of Address
Nov 2, 2017
From: RENESAS SYSTEM DESIGN CO., LTD.
To: RENESAS SYSTEM DESIGN CO., LTD.
Reel/Frame 045807/0091 →
Merger
Nov 2, 2017
From: RENESAS DESIGN CORP.
To: RENESAS SYSTEM DESIGN CO., LTD.
Reel/Frame 044020/0377 →
Merger
Nov 2, 2017
From: RENESAS DEVICE DESIGN CORP.
To: RENESAS LSI DESIGN CORPORATION
Reel/Frame 044020/0419 →
Merger and Change of Name
Nov 2, 2017
From: RENESAS SYSTEM DESIGN CO., LTD.; RENESAS SOLUTIONS CORPORATION
To: RENESAS SYSTEM DESIGN CO., LTD.
Reel/Frame 044020/0475 →
Merger
Nov 2, 2017
From: RENESAS SYSTEM DESIGN CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044020/0503 →
Change of Name
Nov 2, 2017
From: RENESAS LSI DESIGN CORPORATION
To: RENESAS DESIGN CORP.
Reel/Frame 044020/0347 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 044020 Frame: 0377. Assignor(S) Hereby Confirms the Merger.
Dec 11, 2017
From: RENESAS DESIGN CORP.
To: RENESAS MICRO SYSTEMS CO., LTD.
Reel/Frame 045645/0850 →