Magnetic memory device
View Patent ↗A width and a thickness of a bit line are represented as W 1 and T 1 , respectively, a thickness of a digit line is represented as T 2 , and a distance from a center of the digit line in a thickness direction to a center of a free layer of an MTJ element in the thickness direction is represented as L 1 . A width of the digit line is represented as W 2 , and a distance from a center of the bit line in the thickness direction to the center of the free layer of the MTJ element in the thickness direction is represented as L 2 . The distances L 1 and L 2 and the cross-sectional areas S 1 and S 2 are set in such a manner that when L 1 /L 2≧ 1, a relation of (⅓)·(L 1 /L 2 )≦S 2 /S 1 ≦1 is satisfied and when L 1 /L 2 ≦1, a relation of 1≦S 2 /S 1 ≦3(L 1 /L 2 ) is satisfied.
1. A magnetic memory device comprising:
first and second write wires that intersect each other in a non-contact manner; and
a magnetic tunnel junction element which is arranged in an intersection of said first and second write wires and includes a magnetic tunnel junction, wherein
said magnetic tunnel junction element has a free layer consisting of a ferromagnetic material in which a magnetization direction is variable with a magnetic field generated by current flowing through said first and second write wires, and
in the case where a distance between a center of said first write wire in a thickness direction and a center of said free layer in the thickness direction is represented as L 1 ,
a distance between a center of said second write wire in the thickness direction and a center of said free layer in the thickness direction is represented as L 2 ,
a cross-sectional area of said first write wire in a width direction is represented as S 2 and
a cross-sectional area of said second write wire in a width direction is referred to as S 1 ,
said distance L 1 , said distance L 2 , said cross-sectional area S 1 , and said cross-sectional area S 2 are set in such a manner that
when a ratio of said distance L 1 to said distance L 2 is L 1 /L 2 ≧1,
a relation of (⅓)·(L 1 /L 2 )≦S 2 /S 1 ≦1 is satisfied and
when the ratio of said distance L 1 to said distance L 2 is L 1 /L 2 ≦1,
a relation of 1≦S 2 /S 1 ≦3(L 1 /L 2 ) is satisfied, wherein
a material of said first and second write wires is selected from among tantalum in use of tantalum nitride as barrier metal, material of aluminum series, material of titanium series, material of copper series, and material of tungsten series.
2. The magnetic memory device according to claim 1 , wherein
as a material of said aluminum series, one material is selected from among aluminum silicide (AlSi), AlSiCu, and AlCu, and
as a material for said titanium series, titanium nitride (TiN) or titanium suicide (TiSi 2 ) is selected, and
as a material for said copper series, pure copper formed by plating technique or by sputtering technique is selected, and
as a material for said tungsten series, pure tungsten or tungsten suicide (WSi 2 ) is selected.
3. A magnetic memory device comprising:
first and second write wires that intersect each other in a non-contact manner; and
a magnetic tunnel junction element which is arranged in an intersection of said first and second write wires and includes a magnetic tunnel junction, wherein
said magnetic tunnel junction element has a free layer consisting of a ferromagnetic material in which a magnetization direction is variable with a magnetic field generated by current flowing through said first and second write wires, and
in the case where a distance between a center of said first write wire in a thickness direction and a center of said free layer in the thickness direction is represented as L 1 ,
a distance between a center of said second write wire in the thickness direction and a center of said free layer in the thickness direction is represented as L 2 ,
a cross-sectional area of said first write wire in a width direction is represented as S 2 and
a cross-sectional area of said second write wire in a width direction is referred to as S 1 ,
said distance L 1 , said distance L 2 , said cross-sectional area S 1 , and said cross-sectional area S 2 are set in such a manner that
when a ratio of said distance L 1 to said distance L 2 is L 1 /L 2 ≧1,
a relation of (⅓)·(L 1 /L 2 )≦S 2 /S 1 ≦1 is satisfied and
when the ratio of said distance L 1 to said distance L 2 is L 1 /L 2 ≦1,
a relation of 1≦S 2 /S 1 ≦3(L 1 /L 2 ) is satisfied;
when a relation between said distance L 1 and said distance L 2 is L 1 >L 2 ,
said second write wire is made of a metal material having higher melting point than a melting point of a material for said first write wire; and
when the relation between said distance L 1 and said distance is L 1 <L 2 ,
said first write wire is made of a metal material having higher melting point than a melting point of a material for said second write wire; and
when the relation between said distance L 1 and said distance is L 1 <L 2 ,
said first write wire is made of a metal material having higher melting point than a melting point of a material for said second write wire; and
a metal material having higher melting point between said first and second write wires is selected from among tantalum in use of tantalum nitride as barrier metal, material of aluminum series, material of titanium series, material of copper series, and material of tungsten series.
4. The magnetic memory device according to claim 3 , wherein
as a material of said aluminum series, one material is selected from among aluminum suicide (AlSi), AlSiCu, and AlCu, and
as a material for said titanium series, titanium nitride (TiN) or titanium suicide (TiSi 2 ) is selected, and
as a material for said copper series, pure copper formed by plating technique or by sputtering technique is selected, and
as a material for said tungsten series, pure tungsten or tungsten silicide (WSi 2 ) is selected.
5. A magnetic memory device comprising:
first and second write wires that intersect each other in a non-contact manner; and
a magnetic tunnel junction element which is arranged in an intersection of said first and second write wires and includes a magnetic tunnel junction, wherein
said magnetic tunnel junction element has a free layer consisting of a ferromagnetic material in which a magnetization direction is variable with a magnetic field generated by current flowing through said first and second write wires, and
in the case where a distance between a center of said first write wire in a thickness direction and a center of said free layer in the thickness direction is represented as L 1 ,
a distance between a center of said second write wire in the thickness direction and a center of said free layer in the thickness direction is represented as L 2 ,
a cross-sectional area of said first write wire in a width direction is represented as S 2 and
a cross-sectional area of said second write wire in a width direction is referred to as S 1 ,
said distance L 1 , said distance L 2 , said cross-sectional area S 1 , and said cross-sectional area S 2 are set in such a manner that
when a ratio of said distance L 1 to said distance L 2 is L 1 /L 2 ≧1,
a relation of (⅓)·(L 1 /L 2 )≦S 2 /S 1 ≦1 is satisfied and
when the ratio of said distance L 1 to said distance L 2 is L 1 /L 2 ≦1,
a relation of 1≦S 2 /S 1 ≦3(L 1 /L 2 ) is satisfied;
when a relation between said cross-sectional area S 1 and said cross-sectional area S 2 is S 1 >S 2 ,
said first write wire is made of metal material having higher melting point than a melting point of a material for said second write wire; and
when the relation between said cross-sectional area S 1 and the cross-sectional area S 2 is S 1 >S 2 ,
said second write wire is made of a metal material having higher melting point than a melting point of a material for said first write wire; and
a metal material having higher melting point between said first and second write wires is selected from among tantalum in use of tantalum nitride as barrier metal, material of aluminum series, material of titanium series, material of copper series, and material of tungsten series.
6. The magnetic memory device according to claim 5 , wherein
as a material of said aluminum series, one material is selected from among aluminum silicide (AlSi), AlSiCu, and AlCu, and
as a material for said titanium series, titanium nitride (TiN) or titanium suicide (TiSi 2 ) is selected, and
as a material for said copper series, pure copper formed by plating technique or by sputtering technique is selected, and
as a material for said tungsten series, pure tungsten or tungsten suicide (WSi2) is selected.