Semiconductor device and method for manufacturing the same
View Patent ↗An object of the present invention is to provide a semiconductor device having a fin-type transistor that is excellent in characteristics by forming a fin-shaped semiconductor portion and a gate electrode with high precision or by making improvement regarding variations in characteristics among elements. The present invention is a semiconductor device including a fin-shaped semiconductor portion having a source region formed on one side thereof and a drain region formed on the other side thereof, and a gate electrode formed between the source region and the drain region to surround the fin-shaped semiconductor portion with a gate insulating film interposed therebetween. One solution for solving the problem according to the invention is that the gate electrode uses a metal material or a silicide material that is wet etchable.
1. A semiconductor device comprising:
a fin-shaped semiconductor portion having a source region formed on one side thereof and a drain region formed on other side thereof; and
a gate electrode formed between said source region and said drain region to surround a top surface and side surface of said fin-shaped semiconductor portion with only a gate insulating film interposed therebetween,
the semiconductor device further comprising:
a first dummy pattern provided upon forming of said fin-shaped semiconductor portion; and
a second dummy pattern provided upon forming of said gate electrode, wherein said first dummy pattern is positioned under said second dummy pattern, said first dummy pattern is separated from said fin-shaped semiconductor portion, said second dummy pattern is separated from said gate electrode, and said second dummy pattern does not overlap said first dummy pattern.
2. The semiconductor device according to claim 1 , wherein said first dummy pattern does not overlap with a pattern of said fin-shaped semiconductor portion, and said second dummy pattern is not positioned under the pattern of said fin-shaped semiconductor portion.
3. The semiconductor device according to claim 2 , wherein said first dummy pattern is square.