Semiconductor device and method for controlling semiconductor device
View Patent ↗To provide a semiconductor device having a thin-film BOX-SOI structure and capable of realizing a high-speed operation of a logic circuit and a stable operation of a memory circuit. A semiconductor device according to the present invention includes a semiconductor support substrate, an insulation layer having a thickness of at mast 10 nm, and a semiconductor layer. In an upper surface of the semiconductor layer, a first field-effect transistor including a first gate electrode and constituting a logic circuit is formed. Further, in the upper surface of the semiconductor layer, a second field-effect transistor including a second gate electrode and constituting a memory circuit is formed. At least three well regions having different conductivity types are formed in the semiconductor support substrate. In the presence of the well regions, a region of the semiconductor support substrate below the first gate electrode and a region of the semiconductor support substrate below the second gate electrode are electrically separated from each other.
1. A semiconductor device comprising:
a semiconductor support substrate of a first conductivity type;
an impurity layer in the semiconductor support substrate;
an insulation layer formed on said semiconductor support substrate and having a thickness of at most 10 nm;
a semiconductor layer formed on said insulation film;
a logic circuit comprising a first field-effect transistor arranged in an upper surface of said semiconductor layer, and including a first gate electrode and first source and drain regions of a second conductivity type; and
a memory circuit comprising a second field-effect transistor arranged in the upper surface of said semiconductor layer, electrically insulated from said first field-effect transistor by an element separation film arranged in a surface of said semiconductor layer, and including a second gate electrode and second source and drain regions of the second conductivity type, wherein
the impurity layer includes, underneath the first field-effect transistor bounded by the element separation film, a first impurity region of the second conductivity type, and a second impurity region of the first conductivity type arranged in said first impurity region, and includes, direct underneath the first gate electrode of the first field-effect transistor, a third impurity region of the first conductivity type between the second impurity region and the insulation layer for adjusting a threshold voltage of the first field-effect transistor, the first and third impurity regions being physically separated from each other, the first conductivity type being different from the second conductivity type,
the impurity layer includes, underneath the second field-effect transistor bounded by the element separation film, a fourth impurity region of the second conductivity type, a fifth impurity region of the first impurity type in the fourth impurity region, and a sixth impurity region of the first impurity type between the fifth impurity region and the insulation layer for adjusting a threshold voltage of the second field-effect transistor,
the impurity layer further includes seventh impurity regions of the second conductivity type disposed directly underneath the first source and drain regions, respectively, and between the second impurity layer and the insulation layer, the third impurity region being disposed between the seventh impurity regions, and
an impurity concentration of the sixth impurity region is less than that of the third impurity region.
2. The semiconductor device according to claim 1 , wherein
the first source and drain regions are arranged in the surface of said semiconductor layer at both ends of said first gate electrode and constitute said first field-effect transistor, and
in plan view, an end portion of said first source and drain regions at a side of said first gate electrode corresponds to an end portion of said first gate electrode, or is arranged at a side where said first gate electrode is not arranged at a predetermined distance from said end portion of said first gate electrode.
3. The semiconductor device according to claim 2 , wherein said end portions of said first source and drain regions at the side where said first gate electrode is arranged are distant from said end portion of said first gate electrode by at least 0 nm and at most 2 nm in plan view.
4. The semiconductor device according to claim 1 , wherein
the second source and drain regions are arranged in the surface of said semiconductor layer at both ends of said second gate electrode and constitute said second field-effect transistor, and
in plan view, an end portion of said second source and drain regions at a side of said second gate electrode corresponds to an end portion of said second gate electrode, or is arranged at a side where said second gate electrode is not arranged at a predetermined distance from said end portion of said second gate electrode.
5. The semiconductor device according to claim 4 , wherein said end portions of said second source and drain regions at the side where said second gate electrode is arranged are distant from said end portion of said second gate electrode by at least 0 nm and at most 2 nm in plan view.
6. A semiconductor device comprising:
a semiconductor support substrate;
an insulation layer formed on said semiconductor support substrate and having a thickness of at most 10 nm;
a semiconductor layer formed on said insulation film;
a logic circuit comprising a first field-effect transistor arranged in an upper surface of said semiconductor layer, and including a first gate electrode and first source and drain regions of a second conductivity type; and
a memory circuit comprising a second field-effect transistor arranged in the upper surface of said semiconductor layer, electrically insulated from said first field-effect transistor by an element separation film arranged in a surface of said semiconductor layer, and including a second gate electrode and second source and drain regions of the second conductivity type, wherein
the semiconductor support substrate of a first conductivity type includes, underneath the first field-effect transistor bounded by the element separation film, a part of the semiconductor support substrate of the first conductivity type, a first impurity region of the second conductivity type, and a second impurity region of the first conductivity type arranged in said first impurity region, and includes, direct underneath the first gate electrode of the first field-effect transistor, a third impurity region of the first conductivity type between the second impurity region and the insulation layer for adjusting a threshold voltage of the first field-effect transistor, the first and third impurity regions being physically separated from each other, the part of the semiconductor support substrate, the first impurity region, the second impurity region, and the third impurity region being arranged in that order toward the insulation layer, the first conductivity type being different from the second conductivity type,
the semiconductor support substrate of the first conductivity type further includes, underneath the second field-effect transistor bounded by the element separation film, another part of the semiconductor support substrate of the first conductivity type, a fourth impurity region of the second conductivity type, a fifth impurity region of the first impurity type in the fourth impurity region, and a sixth impurity region of the first impurity type between the fifth impurity region and the insulation layer for adjusting a threshold voltage of the second field-effect transistor, the another part of the semiconductor support substrate, the fourth impurity region, the fifth impurity region, and the sixth impurity region being arranged in that order toward the insulation layer,
the semiconductor support substrate of the first conductivity type further includes seventh impurity regions of the second conductivity type disposed directly underneath the first source and drain regions, respectively, and between the second impurity layer and the insulation layer, the third impurity region being disposed between the seventh impurity regions, and
an impurity concentration of the sixth impurity region is less than that of the third impurity region.
7. The semiconductor device according to claim 6 , wherein
the first source and drain regions are arranged in the surface of said semiconductor layer at both ends of said first gate electrode and constitute said first field-effect transistor, and
in plan view, an end portion of said first source and drain regions at a side of said first gate electrode corresponds to an end portion of said first gate electrode, or is arranged at a side where said first gate electrode is not arranged at a predetermined distance from said end portion of said first gate electrode.
8. The semiconductor device according to claim 7 , wherein said end portions of said first source and drain regions at the side where said first gate electrode is arranged are distant from said end portion of said first gate electrode by at least 0 nm and at most 2 nm in plan view.
9. The semiconductor device according to claim 6 , wherein
the second source and drain regions are arranged in the surface of said semiconductor layer at both ends of said second gate electrode and constitute said second field-effect transistor, and
in plan view, an end portion of said second source and drain regions at a side of said second gate electrode corresponds to an end portion of said second gate electrode, or is arranged at a side where said second gate electrode is not arranged at a predetermined distance from said end portion of said second gate electrode.
10. The semiconductor device according to claim 9 , wherein said end portions of said second source and drain regions at the side where said second gate electrode is arranged are distant from said end portion of said second gate electrode by at least 0 nm and at most 2 nm in plan view.