Semiconductor device having elastic solder bump to prevent disconnection
View Patent ↗Regarding a semiconductor device, especially the present invention suppresses disconnection of the connection structure concerned in the semiconductor device which has the electric and mechanical connection structure using solder, and aims at improving connection reliability. And to achieve the above objects, the semiconductor device has the solder bump which electrically connects a semiconductor chip and a package substrate, the under-filling resin with which it filled up between the semiconductor chip and the package substrate, and a solder ball which electrically connects a package substrate with the outside, and the solder bump's elastic modulus is made lower than the elastic modulus of a solder ball.
1. A semiconductor device, comprising:
a semiconductor chip;
a package substrate over which the semiconductor chip is mounted;
a solder bump which electrically connects the semiconductor chip and the package substrate and which does not include Pb as a solder alloy;
under-filling resin which fills up between the semiconductor chip and the package substrate; and
a solder ball which electrically connects the package substrate with an outside and which does not include Pb as a solder alloy;
wherein
the solder bump's elastic modulus is lower than an elastic modulus of the solder ball,
the solder bump and the solder ball includes Ag and Cu, and remainder includes Sn, and
a ratio of a mass of Ag in the solder bump is smaller than a ratio of a mass of Ag in the solder ball.
2. A semiconductor device according to claim 1 , wherein ratio of Ag in the solder bump is less than 1.5 mass %.
3. A semiconductor device according to claim 1 , wherein ratio of Ag in the solder ball is more than 2.5 mass %.
4. A semiconductor device according to claim 1 , wherein
the solder bump includes Cu, and remainder includes Sn; and the solder ball includes Ag and Cu, and remainder includes Sn.
5. A semiconductor device according to claim 4 , wherein
ratio of Ag in the solder ball is more than 2.5 mass %.
6. A semiconductor device according to claim 1 , further comprising:
a mounting substrate which mounts the package substrate;
wherein
the mounting substrate is electrically connected to the package substrate via the solder ball; and
under-filling resin is not formed between the mounting substrate and the package substrate.
7. A semiconductor device according to claim 1 , wherein
the semiconductor chip has a first pad electrically connected with the solder bump;
the package substrate has a second pad electrically connected with the solder bump; and
an electric connection area to the solder bump in the first pad surface is smaller than an electric connection area to the solder bump in the second pad surface.
8. A semiconductor device according to claim 1 , wherein
the semiconductor chip has a first pad electrically connected to the solder bump;
the package substrate has a second pad electrically connected to the solder bump;
a predetermined first metallic film is formed in a front surface, and the first pad is connected to the solder bump via the first metallic film concerned;
a predetermined second metallic film is formed in a front surface, and the second pad is connected to the solder bump via the second metallic film concerned; and
an area of an interface of the first pad and the first metallic film is smaller than an area of an interface of the second pad and the second metallic film.