Patent Assignment
Reel/Frame 019459/0479
Assignment of Assignor's Interest
Recorded: 2007-06-13
Pages: 3
Assignor
HAYASHI, EIJI
Executed: 2007-05-16
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Having Elastic Solder Bump to Prevent Disconnection
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.