Patent Assignment
Reel/Frame 021789/0579
Assignment of Assignor's Interest
Recorded: 2008-11-05
Pages: 2
Assignors
KIM, DONG-HAN
Executed: 2008-10-02
CHOI, KYOUNG-SEI
Executed: 2008-10-02
KIM, CHUL-WOO
Executed: 2008-10-02
Assignee
SAMSUNG ELECTRONICS CO., LTD
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Cutting Semiconductor Wafer, Semiconductor Chip Apparatus, and Chamber to Cut Wafer