Patent Assignment
Reel/Frame 021794/0741
Assignment of Assignor's Interest
Recorded: 2008-11-07
Received: 2008-11-07
Pages: 5
Assignor
MODINE MANUFACTURING COMPANY
Executed: 2008-04-29
Assignee
THERMAL CORP.
RT. 113 & EDWARD STREET, GEORGETOWN, DE, 19947, UNITED STATES
Covered Properties
(6)
Power System
Application:
11/342,529 →
Cooling System for Computer Electronics
Application:
11/266,812 →
Vapor compression cooling system for cooling electronics
Application:
11/264,406 →
Bonded Silicon, Components and a Method of Fabricating the Same
Application:
10/921,527 →
Forced Fluid Heat Sink
Application:
10/739,759 →
Modular Cooling System and Thermal Bus for High Power Electronics Cabinets
Application:
09/963,899 →